Engineering Technician

Job description: Location: Santa Clara, CA Pay: $35hr + 10% shift differential Schedule: Monday-Friday 6PM-2:30AM training during the day before reporting to graveyard shift TEAM 4: Thursday to Saturday - Wednesday is alternating, 6pm to 6:30am The Engineering Technician plays a key role in operating semiconductor wafer slicing and processing equipment within a high-volume, production manufacturing environment. The role involves meeting quality, safety, and productivity goals while collaborating closely with teammates, area leads, and supervisors to achieve shared performance objectives. Key Responsibilities Operate and, when necessary, set up production wafer slicing and processing equipment while managing multiple tasks efficiently. Learn and become proficient in various manufacturing processes, maintaining high standards for quality, safety, and efficiency. Troubleshoot and handle a variety of operational tasks, including rework, requiring an understanding of multiple processing stations and finished products. Inspect your own work and as needed, the work of others to ensure quality standards are met. Document processes accurately, including material requests, quality issues, efficiency tracking, and measurement reporting. Identify and escalatte build issues and collaborate with relevant teams to resolve them promptly. Contribute to team success by mentoring and coaching new team members as needed. Support team goals by participating in preparation work, such as line clearance and changeovers, and ensuring accurate material counts. Maintain a strong attendance record and adherence to safety and regulatory policies. Perform other duties as assigned. Qualifications Education and Experience: High school diploma, equivalent technical training, or relevant experience is required. An associate's degree in a technical field is preferred. At least 1-2 years of experience in an environment requiring attention to detail and following instructions consistently. Skills and Attributes A willingness to learn and develop technical knowledge in wafer fabrication. Strong attention to detail, craftsmanship, and time management skills to prioritize multiple tasks. Problem-solving mindset and adaptability to changing priorities. Ability to work effectively in a team-oriented environment. Commitment to fostering a safe and inclusive workspace. Physical Requirements Comfortable lifting 30-50 pounds as part of daily work. Ability to work long hours or overtime when necessary to meet deadlines. Preferred Skills and Knowledge Basic computer skills, including familiarity with personal computers and online documentation. Ability to use basic tools and measurement instruments, such as calipers and gauges. Mathematical proficiency, including adding, subtracting, calculating percentages, and understanding tolerances. Strong communication skills for writing clear documentation, providing feedback, and collaborating with diverse teams. Flexibility to work varying shifts and meet cleanroom requirements, including wearing PPE and adhering to cleanroom standards. Job Types Full-time, Temporary Benefits Dental insurance Health insurance Vision insurance Experience Machine operation: 2 years (Required) Process engineering: 2 years (Preferred) Wafer slicing: 2 years (Required) Mechanical troubleshooting: 1 year (Preferred)

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