Principal Mechanical Engineer

Principal Mechanical Engineer

This role has been designed as Onsite with an expectation that you will primarily work from an HPE office.

Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Roles & Responsibilities

• Develop and own structural FEA simulation capabilities to support multiple ongoing NPI projects as well as sustaining issues as they arise
• Improve simulation accuracy continuously through test correlation and model refinement
• Maintain and coordinate multiple FEA projects done by yourself, other internal functions, as well as external partners
• Drive and review FEA simulation efforts by component suppliers and ODMs
• Participate from Concept phase to provide design guidance by running FEA studies on areas of concern
• Act as the main point of contact for all mechanical-related issues that arise from MDVT and HALT and lead issue resolution by validating design changes through simulation and/or test
• Design and prototype chassis and fixture for testing
• Become the in-house expert in strain gauge applications and accelerometer measurements during MDVT and HALT
• Conduct thorough processing and analysis of test data including microstrain, G-levels, and ASIC temperatures throughout MDVT and HALT
• Document tests and FEA simulations, including static loading, modal analysis and dynamic, in each NPI project’s design review and be responsible for the system’s structural integrity
• Communicate recommended design changes effectively to HW leads with strong justification backed by FEA model results
• Collaborate with ASIC development team to generate 3D models of ASICs based on package outline drawings including BGAs and conduct near-package or co-package connector placement and floorplan studies as required
• Support manufacturing and operations’ efforts to improve production yield by performing FEA studies or running limited design of experiments in lab
• Provide mechanical design and structural analysis support across multiple product development programs, including chassis design, packaging, reliability, and manufacturability.
• Participate in hands‑on engineering activities, including CAD design and reviews, tolerance analysis, prototyping, testing, and root‑cause investigations.
• Collaborate with cross‑functional teams and suppliers to identify technical risks, resolve design and manufacturing issues, and implement corrective actions.
• Contribute to mechanical specifications, design guidelines, validation plans, and engineering best practices.
• Provide project scoping, resource estimates, schedule input, and technical guidance for new product development efforts.

Qualifications

• 10+ years of experience in electromechanical product development.
• MS in Mechanical Engineering, Applied Physics or equivalent.
• Experience developing networking, server, storage, telecommunications, or high-performance computing systems.
• Extensive experience with chassis development, system packaging, and high-density electronic assemblies.
• Experience in FEA and familiarity with ANSYS Workbench, including static‑structural, modal analysis, transient mode superposition, Eigenvalue‑Buckling, and steady‑state thermal, are necessary.
• Strong hands‑on experience with tolerance analysis, GD&T, stack‑up analysis, and structural analysis techniques.
• Expected Competencies Expert‑level proficiency with 3D solid modeling tools; SolidWorks experience preferred.
• Working knowledge of EPDM or equivalent PLM systems is a plus.
• Experience in LS‑Dyn a and response spectrum analysis are highly desired but not necessary.
• Experience in meshing sheet metal geometries as solid or as shell elements and working knowledge of defeaturing non‑structural elements to simplify mesh.
• Good structural intuition of load path in a mechanical design.
• Strong and proven ability to break complex system design down to a sub‑system in order to simplify FEA setup and runtime.
• Familiarity with test standards including GR‑63, IPC‑9704, and ASTM D4169.
• Strong working knowledge of Young’s modulus (E) and coefficients of thermal expansion (CTEs) of common materials used in ASIC and cooling components.
• Experience in modeling of die warpage due to thermal effects and with heatsink loading is highly desired.
• Previous training with strain gauge applications on PCB and data analysis involving principal microstrain, as well as strain rate, is highly desired.
• Experience with accelerometer G‑value data filtering and analysis from dynamic tests such as vibration and shockdoes.
• Proven hands‑on experience in dynamic testing.
• Knowledge of dye‑and‑pry, Shadowmoire, operation of 3D‑scanning metrology equipment.
• Extensive experience developing complex chassis and system‑level mechanical designs for networking, server, storage, or telecommunications products.
• Experience with ECAD‑MCAD integration and IDF workflows.
• Deep understanding of sheet metal design, machining, castings, extrusions, plastics, and associated manufacturing processes.
• Strong understanding of tooling requirements and manufacturing considerations for volume production.
• Strong understanding of NEBS, EMI, EMC, Safety, and other regulatory compliance requirements.
• Proven ability to troubleshoot complex system‑level mechanical issues in laboratory, manufacturing, and field environments.
• Experience leading root‑cause investigations and implementing corrective actions.
• Excellent communication and leadership skills with the ability to influence cross‑functional teams.
• Comprehensive understanding of the complete product development lifecycle from concept through production and field support.

Benefits

• Health & Wellbeing We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.
• Personal & Professional Development We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.
• Unconditional Inclusion We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Job: Engineering Job Level: TCP_05

United States of America: Annual Salary USD 140,500 - 285,000 in California. The listed salary range reflects base salary. Variable incentives may also be offered. Information about employee benefits offered in the US can be found at

Accessibility HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here. Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together.

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