Head of IC Design

DescriptionRole PurposeLead Power Integrations’ global IC design organization, ensuring the successful and predictable execution of all silicon development aligned to product architectures and Market-driven roadmaps.This role owns the delivery of high-quality, manufacturable ICs, translating product and system requirements into silicon while maintaining strong execution discipline, risk management, and cross-functional alignment.Working closely with Product & Technology Development, Marketing, Operations, and Business Units, this leader ensures silicon delivery meets performance, cost, quality, and schedule commitments.Business Ownership & Impact• Own execution and delivery of all IC development programs.• Ensure predictable silicon delivery aligned to product commitments.• Drive improvements in:o First-pass silicon successo Development cycle timeo Design productivity and reuse• Balance design innovation with execution risk and schedule confidence.• Ensure designs meet:o Performance targetso Cost and area targetso Manufacturability and yield requirementsCore ResponsibilitiesIC Design Execution & Delivery• Lead all IC development across:o Analog designo Digital designo Mixed-signal integrationo Design verificationo CAD/Layouto Design reuse• Ensure high-quality execution from specification through tape-out and silicon validation.• Deliver designs that meet schedule, performance, cost, and quality targets.Alignment to Product & Marketing Requirements• Work closely with Product & Technology and Marketing to ensure clear translation of roadmap requirements into design specifications.• Provide early input on feasibility, risk, and trade-offs.• Maintain alignment between architecture intent and silicon implementation.Design Methodology & Productivity• Establish best-in-class design methodologies, tools, and flows.• Drive improvements in:o Design reuseo Verification coverageo Silicon iterations o Time-to-functioning silicon• Build scalable design infrastructure to support future growth.Cross-Functional Integration• Partner closely with:o Product & Technology (architecture and requirements)o Marketing (roadmap alignment)o Operations (process, yield, cost, backend execution)o Business Units (application needs and priorities)• Ensure tight alignment between design, manufacturing, and system requirements.Risk Management & Predictable Execution• Implement disciplined design and verification processes to reduce execution risk.• Identify and manage technical risks early in the development cycle.• Ensure high confidence in tape-out schedules and silicon success.• Drive a culture of accountability and delivery predictability.Organizational Leadership• Lead global IC design teams across regions.• Build a strong technical culture focused on:o Qualityo Execution disciplineo Risk managemento Design reuseo Continuous improvement• Recruit, develop, and retain top engineering talent.Ideal Profile• 15+ years of experience in IC design (analog, mixed-signal, or power ICs).• Proven leadership of global IC design teams.• Deep expertise in:o High-voltage / power IC designo Mixed-signal integrationo Semiconductor processes (BCD, HV, GaN preferred)• Strong track record of delivering silicon on schedule with high quality.• Experience improving design productivity and execution predictability.• Strong cross-functional collaboration skills across product, marketing, and operations.