Media & Collateral Packaging Engineer
Intel
Intel in Phoenix, AZ is seeking a Packaging Module Development Engineer to shape the development and optimization of assembly media and collaterals. You will design solutions to improve reliability, manufacturability, and cost efficiency across the packaging technology roadmap. Join Intel's Media Development group to advance semiconductor packaging processes, apply DOE and SPC techniques, and contribute to high-impact projects with cross-functional teams in an on-site setting. #J-18808-Ljbffr Intel
Vacancy posted more than 2 months ago
Do you want to receive more vacancies?
Subscribe and receive similar vacancies to Media & Collateral Packaging Engineer. Be the first to apply!
