Director, Advanced Power Silicon & Packaging Technology

Position Summary
The Director of Advanced Power Silicon & Packaging Technology leads the strategy, architecture, development, and deployment of next-generation power delivery technologies spanning silicon, package, and system integration. This role is responsible for driving innovation in power semiconductors, advanced packaging, and silicon-package-system co-optimization for AI, datacenter, networking, and high-performance computing platforms.

The director partners across silicon design, packaging, architecture, manufacturing, and product organizations to deliver breakthrough improvements in power efficiency, power density, performance, reliability, and total cost of ownership.

Key Responsibilities
Technology Strategy & Vision

Define and execute the long-term roadmap for:

Advanced power silicon technologies

Advanced packaging and heterogeneous integration

Chip-package-system co-design

Vertical power delivery solutions

Identify disruptive technologies and assess strategic investment opportunities.

Drive technology differentiation and competitive advantage.

Power Silicon Leadership

Drive adoption of advanced semiconductor technologies including:

GaN power devices

SiC technologies

Advanced CMOS and BCD power processes

Optimize power efficiency, die area, and reliability.

Advanced Packaging Leadership

Establish packaging technology roadmaps for:

2.5D and 3D packaging

Chiplet architectures

Silicon interposers

Fan-out packaging

Embedded power delivery

Co-packaged solutions

Lead package electrical, thermal, and mechanical optimization.

Drive package innovations enabling higher power density and lower power delivery losses.

Silicon-Package-System Co-Design

Lead cross-functional initiatives to optimize:

Power integrity (PI)

Signal integrity (SI)

Thermal performance

Electromigration reliability

Power delivery network (PDN)

Develop end-to-end power architectures from regulator to transistor.

Research & Innovation

Lead advanced technology incubation and proof-of-concept programs.

Build strategic partnerships with:

Semiconductor foundries

OSAT partners

EDA vendors

Universities and research institutions

Create and manage intellectual property portfolios.

Drive patent generation and technical publications.

Organizational Leadership

Establish a culture of technical rigor, innovation, accountability, and execution excellence.

Mentor senior technical leaders and develop organizational capability.

Required Qualifications
Education

BS in Electrical Engineering, Physics, Materials Science, or related discipline.

MS or PhD preferred.

Experience

15+ years of semiconductor and power technology experience.

6+ years leading technology, architecture, or engineering organizations.

Proven success delivering innovative silicon and packaging technologies from concept through production.

Technical Expertise
Power Silicon

Power semiconductor devices

Power integrity analysis

Advanced Packaging

Chiplet integration

2.5D/3D packaging

Fan-out technologies

Silicon interposers

Package reliability and qualification

Systems Knowledge

Power delivery networks

Thermal management

Manufacturing and supply chain considerations

Preferred Qualifications

Expertise in:

Vertical power delivery

Backside power distribution networks

Embedded voltage regulation

Strong patent portfolio and industry recognition.

Participation in IEEE, OCP, JEDEC, or semiconductor standards organizations.

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