SMT Rework Lead

Description The SMT Rework Lead is responsible for leading daily rework and repair operations within a high‑mix RF electronics manufacturing environment. This role combines hands‑on technical repair work with leadership responsibilities to ensure product quality, throughput, schedule adherence, and continuous improvement across the rework area. The ideal candidate is an experienced electronics technician with strong SMT/BGA rework capability, leadership presence, and the ability to balance production demands with quality expectations in a fast‑paced manufacturing setting.

RESPONSIBILITIES

Job responsibilities include, but are not limited to: Leadership & Team Oversight Lead and coordinate daily activities of the SMT rework team. Assign work based on production and engineering priorities, technician skill levels, and customer deadlines. Provide technical guidance, coaching, and training to rework technicians. Monitor team performance, productivity, workmanship, and adherence to procedures. Support hiring, onboarding, cross‑training, and performance feedback efforts. Promote a culture of accountability, quality, urgency, and continuous improvement. Technical Rework & Repair Perform complex SMT and through‑hole rework and repair on RF electronic assemblies and PCAs. Conduct BGA/QFN/QFP component removal and replacement using rework equipment. Interpret schematics, assembly drawings, BOMs, ECOs, and work instructions. Support failure analysis and root cause investigations alongside Quality and Engineering teams. Verify workmanship to IPC standards and internal customer requirements. Production & Throughput Support Support daily production goals by maintaining efficient repair turnaround times. Escalate material shortages, tooling issues, or process bottlenecks impacting flow. Track and communicate rework status, aging jobs, and repair metrics. Ensure proper documentation of repairs, defects, and disposition activities in ERP/MES systems. Quality & Compliance Ensure all work complies with IPC‑A‑610, J‑STD‑001, ESD and company workmanship standards. Maintain accurate repair records and defect tracking documentation. Drive reduction of repeat defects and rework trends through corrective action participation. Support audits, customer inspections, and process validation activities, as required. Continuous Improvement Identify opportunities to improve repair processes, tooling, fixtures, and workflow efficiency. Recommend process improvements to reduce defects and increase first‑pass yield. Assist in development and refinement of rework procedures and visual aids. Support Lean manufacturing and 5S initiatives within the work area. Requirements

SKILLS, EXPERIENCE & EDUCATION

High school diploma or GED required 5+ years of SMT rework/repair experience in electronics manufacturing 2+ years of leadership, lead, or mentoring experience Strong hands‑on experience with SMT, fine‑pitch, BGA, QFN, and RF PCB assemblies Ability to read schematics, assembly drawings, and technical documentation Experience using microscopes, soldering stations, hot air systems, and BGA rework equipment Knowledge of IPC‑A‑610 and J‑STD‑001 standards Familiarity with ESD handling requirements and controlled manufacturing environments Strong organizational, communication, and troubleshooting skills Preferred job skills, experience and education include: Technical degree or electronics certification IPC‑A‑610 and/or J‑STD‑001 certification(s) Experience in RF, defense, aerospace, telecommunications, or high‑reliability electronics manufacturing Familiarity with ERP/MRP or MES systems Experience supporting Lean manufacturing initiatives

WORK ENVIRONMENT & PHYSICAL REQUIREMENTS

Climate‑controlled electronics manufacturing environment Exposure to soldering fumes, ESD‑controlled areas, and precision manufacturing equipment Fast‑paced production environment with shifting priorities and schedule‑driven deadlines Ability to sit or stand for extended periods Ability to work under microscope magnification for prolonged periods Frequent use of hands for fine motor soldering and assembly tasks Ability to occasionally lift up to 25 lbs. #J-18808-Ljbffr EPIQ DESIGN SOLUTIONS, LLC.