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Senior Design Automation Engineer — AI IC Packaging & PCB

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Annapurna Labs, part of Amazon, seeks a Senior Design Automation Engineer to advance physical design for Package and PCB in next-generation ML and data center ASICs. You will develop automation from floor planning to tape-out, collaborating with SI/PI, thermal, and manufacturing teams to deliver production-ready designs that meet performance targets.

You will build data integration flows, write Python/Skill/TCL, and contribute to cross-level optimization while refining DFM rules across OSATs and

#J-18808-Ljbffr Jobleads-US
Vacancy posted 1 day ago
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