Sign up to access all features of our service.
  • Job search
  • Favorites
  • Create a CV
    New
  • Salaries
  • Subscriptions

Principal Foundry Interface Design Engineer, HBM

$150k - $308k

Micron Technology Inc

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description We are the HBM Design Architecture team within Micron's HBM DRAM Engineering Group. We work at the intersection of design, technology, and manufacturing to deliver next‑generation HBM solutions that power AI and ML workloads worldwide. Our team thrives on deep technical collaboration, global partnerships, and solving problems that truly push memory technology forward! In this full‑time onsite role, you will provide critical technology support for the design and development of advanced HBM DRAM products. You will serve as a bridge between internal design teams, foundries, and technology development groups, helping translate advanced process capabilities into scalable, high‑performance architectures. Your work will directly impact performance, power efficiency, reliability, and long‑term HBM roadmap success. This role supports the design and deployment of AI‑enabled solutions that improve efficiency and decision‑making. Responsibilities The responsibilities outlined below represent key areas of focus for this role and are intended to be illustrative rather than exhaustive. Candidates are expected to demonstrate proven experience in at least three of the five focus areas outlined below. Foundry Interface and Technology Alignment Act as the primary technical interface between foundry partners and Micron design organizations. Drive closure of design‑process gaps through collaborative engagement with foundry process teams. Influence foundry roadmaps related to TSV, BEOL, reliability, and design enablement. Define technology requirements for future HBM and custom memory products. Circuit Simulation and Analysis Perform HSPICE simulations for technology evaluation and design optimization. Evaluate compact models, PDK SPICE models, and process corners. Conduct pre‑layout and post‑layout circuit analysis. Support BEOL optimization and routing studies through simulation. Develop methodologies for evaluating design sensitivity to process variations. Test‑Chip and Silicon Validation Plan and implement technology evaluation test chips. Define process monitor structures and benchmark vehicles. Analyze post‑silicon data and correlate results with simulations. Collaborate with product engineering and foundry/Fab teams on silicon learning and technology qualification. PDK and Design Enablement Evaluate foundry PDKs and IP collateral. Support design teams by providing technology guidelines and best‑known methods. Drive creation of design recommendations, analog guidelines, and digital PPA evaluation methodologies. Collaborate with CAD teams on flow enablement and validation. AI‑Enabled Productivity and Efficiency Improvement Identify and implement AI‑enabled workflows, automation opportunities, and knowledge‑management practices to improve engineering productivity, decision quality, and execution efficiency across DTCO, foundry interface, PDK evaluation, and design enablement activities. Minimum Qualifications BS, MS, or PhD or equivalent experience in Electrical Engineering, Computer Engineering, or related field. 6+ years of semiconductor industry experience and Solid understanding of advanced semiconductor technology development Strong grasp of advanced CMOS technology nodes, FinFET devices, and process integration. Hands‑on experience with: HSPICE simulations, Device characterization, Standard cell benchmarking, PPA analysis, Parasitic extraction and physical verification Experience in driving AI‑enabled engineering practices and automation to improve the efficiency of DTCO analysis, foundry collateral evaluation, PDK enablement, benchmarking, and collaboration across build teams. Preferred Qualifications Experience working directly with leading foundries such as TSMC, Samsung, Intel Foundry Services, or GlobalFoundries. Experience with memory products including DRAM, HBM, or SRAM. Knowledge of: TSV technologies, Advanced packaging, Reliability modeling and aging simulations, Advanced BEOL technologies, PDK development and validation Ability to apply AI tools to summarize, analyze, and extract insights from: PDK documentation, Design Rule Manuals (DRMs), Reliability reports, Foundry collateral, Silicon characterization data, Experience leading technology pathfinding and node selection activities. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $150,000.00 - $308,000.00 a year Additional Compensation May Include Benefits, Bonuses And Equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job‑related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. To learn more about Micron, please visit micron.com/careers #J-18808-Ljbffr Micron Technology

Vacancy posted 3 days ago
Similar jobs that could be interesting for youBased on the Principal Foundry Interface Design Engineer, HBM in Folsom, CA vacancy
  •  ...Group. Key Responsibilities Design and implement RTL for SoC‑level...  ...and subsystems used in HBM logic die. Integrate internal...  ...microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑...  ...multi‑functionally with Product Engineering, Test, Probe, Process Integration... 
    Suggested
    Local area
    Night shift

    Micron Technology, Inc

    Folsom, CA
    2 days ago
  • $103k - $210k

     ...advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group...  ...drive the implementation of advanced HBM SoC logic/base die designs from netlist...  ...., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent... 
    Suggested
    Full time
    Local area
    Night shift

    Micron Technology, Inc.

    Folsom, CA
    2 days ago
  • $121k - $247k

     ...and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous...  ...development, and integration of next-generation HBM SoC logic die. You will work closely...  ..., microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY-adjacent logic)... 
    Suggested
    Full time
    Local area
    Night shift

    Micron Technology

    Folsom, CA
    2 days ago
  • Micron Technology is seeking a SoC Design Engineer to join the Heterogeneous Integration Group in California. You will design RTL for SoC-level blocks in HBM logic die and integrate IP, collaborating with architecture, verification, and physical design teams to meet power... 
    Suggested

    Micron Technology

    Folsom, CA
    2 days ago
  • $174k - $352.5k

     ...Senior Principal ASIC Design Engineer This role has been designed as "Onsite" with an expectation that you will primarily work from an HPE office...  ...at least two of the following areas: 10G–800G Ethernet interface standards; HBM2, HBM2E, DDR4, or related memory... 
    Principal
    Work experience placement
    Work at office

    Hewlett Packard Enterprise

    Roseville, CA
    15 hours ago
  • $175k - $199k

     ...today! GENERAL JOB SUMMARY: Designs and drafts components, assemblies...  ...Prepares formal, controlled engineering documentation (i.e. drawings...  ..., parts lists and interface control documents). Proficient...  ...Management System procedures. Principal Design Engineer (V) Work is... 
    Principal
    For contractors
    Work at office
    Local area
    Immediate start
    Weekend work

    Kratos Unmanned Systems

    Roseville, CA
    1 day ago
  •  ...in the Heterogeneous Integration Group. This position involves designing RTL for SoC-level components and collaborating with SoC...  ...Candidates should have a bachelor’s or master’s degree in electrical engineering or a related field with a minimum of 10 years of experience,... 

    Micron Technology, Inc

    Folsom, CA
    2 days ago
  • Micron Technology, Inc. is seeking a SoC Physical Design Engineer in the Heterogeneous Integration Group to drive implementation from netlist to GDSII and ensure top‑level integration across products. You will collaborate with RTL, verification, DFT, IP, packaging and manufacturing... 

    Micron Technology, Inc.

    Folsom, CA
    2 days ago
  • $140k - $180k

    Job Description Kratos Microwave, Inc., a Kratos' company, is looking for a Principal RF Design Engineer 6 to work onsite at their Folsom, CA facility. Job Description Kratos Microwave, Inc., a Kratos' company, is looking for a Principal RF Design Engineer 6 to work onsite... 
    Principal
    Full time
    Temporary work
    Work at office

    Kratos Defense and Security Solutions

    Folsom, CA
    2 days ago
  • Microchip Technology Inc. is seeking a Principal Design Engineer for the Architecture Co-Verification (ACOV) team. You will collaborate with hardware designers, firmware engineers, and verification teams across the SoC development lifecycle, from architectural exploration... 
    Principal

    Microchip Technology Inc.

    Roseville, CA
    2 days ago
  • $141.91k - $269.1k

     ...power of Intel's 18A process and design infrastructure. We are...  ...an exceptional Quantum Design Engineer to join our pioneering quantum...  ...teams, but also with teams in Foundry lithography, process and design...  ...to co-design Interposer interfaces and routing strategies for bridging... 
    Internship
    Local area
    Immediate start
    Shift work

    Intel

    Folsom, CA
    3 days ago
  •  ...will primarily involve RTL blocks, Clock Tree, Timing, and Signoff activities. Candidates should have strong hands-on ASIC Physical Design / Implementation experience. Preferred Candidate Background: Candidates from Broadcom, Google, Intel , etc. are highly preferred.... 
    Contract work

    LanceSoft, Inc.

    Folsom, CA
    2 days ago
  • Micron Technology is seeking a Principal Signal Integrity Engineer to lead high‑speed interface SI efforts. You will own modeling from extraction to simulation, evaluate...  ...work with senior engineers across SI, circuit design, packaging R&D, and system integration to shape... 

    Micron Technology

    Folsom, CA
    3 days ago
  • Intel Corporation in Santa Clara is seeking a GPU Logic Design Engineer to develop RTL and GPU IP blocks for next-generation SoCs. You will optimize logic for power, performance, area, and timing while aligning with architecture and microarchitecture targets. You will verify... 

    Intel Corporation

    Folsom, CA
    2 days ago
  • LanceSoft, Inc. is seeking an experienced ASIC Physical Design engineer to own end-to-end RTL-to-GDS flows, with strong hands-on experience in GDSII/STA, clock tree synthesis (CTS), timing closure and signoff, and robust RTL block implementations. Preference for candidates... 
    Contract work

    LanceSoft, Inc.

    Folsom, CA
    2 days ago
  • A leading semiconductor company in California is looking for a Semiconductor Design Engineer with over 10 years of experience. The role involves designing and evaluating semiconductor devices, focusing on IO definition and power-efficient designs. Ideal candidates will... 

    ARTSMARTUK LTD.

    Folsom, CA
    2 days ago
  •  ...customers and internal stakeholders (from engineering to operations to media architecture and...  ...working knowledge across several (NVMe interface, NAND, ASIC, DRAM, firmware, hardware, validation...  ...for your area in concept reviews, design reviews, and technical stage gate... 
    Principal

    Micron

    Folsom, CA
    15 hours ago
  • Intel Corporation's Quantum Computing Group seeks a Quantum Design Engineer to scale qubit processors from concept to tapeout and fab readiness. You will collaborate with qubit, control, and PDK teams to implement qubit PDKs, design rules, and automated flows for large-... 

    Intel

    Folsom, CA
    3 days ago
  • $105.65k - $200.34k

    Job Details: Job Description: As a GPU Logic Design Engineer, you will play a vital role in developing cutting-edge graphics IPs required for next-generation GPU designs. By leveraging your expertise in logic design and RTL coding, you will contribute to the creation of... 
    Internship
    Local area
    Immediate start
    Shift work

    Intel Corporation

    Folsom, CA
    2 days ago
  • $105.65k - $149.15k

     ...Job Details: Job Description: As a SoC Design Verification Engineer, you will be responsible for ensuring the functionality and reliability of Intel's cutting-edge server SoCs. You will perform functional logic verification and emulation validation to confirm designs... 
    Internship
    Local area
    Immediate start
    Shift work

    Intel

    Folsom, CA
    1 day ago
  • Overview Join to apply for the Semiconductor Design Engineer role at ARTSMARTUK LTD. Responsibilities Performs semiconductor design engineering assignments including engineering and designing chip layout circuits, circuit checking, documenting specifications, modifying... 

    ARTSMARTUK LTD.

    Folsom, CA
    2 days ago
  • $141.91k - $269.1k

     ...components, including 3D graphics, media, and display, to ensure design will meet specification requirements. Defines and develops...  ...for this position. Bachelor’s degree in electronics, computer engineering, or related engineering with 5+ years of experience. OR Master... 
    Local area
    Immediate start
    Shift work

    Intel

    Folsom, CA
    3 days ago
  • $119k - $320k

     ...to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About The Role At Micron, we transform how...  ...coordination with supporting organizations Design Rule Development — Driving progressive design rules that... 
    Principal
    Full time
    Local area
    Immediate start

    Micron Technology

    Folsom, CA
    3 days ago
  • $116.79k - $237.71k

     ...About the Organization Foundry Business Group Operations is...  ...effectively and will be the interface for all things Silicon and or...  ...Services customers. Through designing and executing analytics, you...  ...demand using BY CDP tool, and Engineering demand using SAP IBP tool.... 
    Local area
    Immediate start
    Shift work

    Intel

    Folsom, CA
    3 days ago
  • $135k - $286k

     ...As a Product Architecture Engineer for DRAM, you will play a key role in defining how Micron memory technologies enable AI training and...  ...differentiated DRAM solutions while influencing both customer designs and Micron’s product roadmap. Responsibilities Explore and evaluate... 
    Principal
    Local area

    Micron Technology

    Folsom, CA
    4 days ago
  • $110k - $170k

     ...interconnected world. Our solutions are designed to not only meet the current demands of...  ...prestigious awards, such as Best Engineering Team, Best Company for Diversity, Compensation...  ...switches, alongside critical I/O interfaces (e.g., PCIe, Interlaken, Ethernet PHY/MAC... 
    Local area

    Arista

    Roseville, CA
    15 hours ago
  • $121.28k - $194.1k

    A leading memory technology company based in Rancho Cordova, California, is seeking a 3D NAND IP Logic Design Engineer. This role involves architectural design and verification of logic circuits for NAND flash memory, with responsibilities ranging from developing micro-... 

    Solidigm

    Rancho Cordova, CA
    2 days ago
  • Solidigm Inc. seeks a 3D NAND IP Logic Design Engineer to help shape the future of memory technology in its Rancho Cordova, CA location. You will architect, design, verify logic and circuit blocks for 3D NAND components, implement RTL in SystemVerilog, and drive sign-off... 

    Solidigm Inc.

    Rancho Cordova, CA
    2 days ago
  • Intel Corporation's Foundry Sales Operations is seeking an experienced Sales Operations and Revenue Analyst to lead cross-functional initiatives that drive growth and optimize revenue for the Foundry Business Group. This role blends strategic vision with structured execution... 

    Intel Corporation

    Folsom, CA
    15 hours ago
  • Kratos Defense and Security Solutions is seeking a Principal RF Design Engineer 6 to design RF and microwave solid state power amplifiers (SSPAs) and related circuitry. Work will span 500 MHz to 100 GHz using GaN/GaAs/InP/SiGe devices, with emphasis on rugged, aerospace... 

    Kratos Defense and Security Solutions

    Folsom, CA
    2 days ago

Do you want to receive more vacancies?

Subscribe and receive similar vacancies to Principal Foundry Interface Design Engineer, HBM. Be the first to apply!