Product Development Engineer 1

Responsibilities Conduct Physical Defect Analysis. Find and analyze physical defects. Relate electrical failure modes to physical defects. Utilize layout to correlate failures when necessary. Perform layer‑by‑layer de‑processing using wet and dry etch. Operate the Focused Ion Beam (FIB) and Scanning Electron Microscope (SEM). Perform fault isolation through voltage contrasting (PVC). Prepare Scanning Transmission Electron Microscope (STEM) and Transmission Electron Microscope (TEM) samples. Submit TEM requests for full analytic work. Save images and write detailed reports. Consult with customers. Create DRAM - Dynamic Random Access Memory (DRAM) Physical Failure Analysis (PFA) and procedural reference documents. May telecommute part‑time. Qualifications Employer will accept a Bachelor's degree in Engineering or a related field. Position Requirements Focused Ion Beam and Scanning Electron Microscope Prepare lamella (very thin sample) for STEM and TEM analysis De‑layering samples using combination of mechanical polish, chemical and dry etch Chemical safety procedures CAD (computer aided design) layout Statistical tools for detailed data analysis on product to drive yield improvement projects Benefits Micron offers medical, dental, and vision plans, paid time off, paid holidays, paid family leave, and income protection if unable to work due to illness or injury. Equal Opportunity Employer Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr Micron Technology