Optoelectronic Assembly

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team is shaping the future of our industry and share our passion to reveal the invisible!

 

Our Wire Bonders are responsible for precision assembly of optoelectronic components in our cleanroom manufacturing environment. This role supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips / die mounted to ceramic substrates and / or packages such as TO cans and LCCs. The Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements.

 

This full-time, non-exempt role will report to the Director of Operations and is located at our Salem, NH Facility. 

 

Key Responsibilities

Assembly & Wire Bonding

• Perform manual and semi automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wire

• Prep material. set up, and operate wire bond equipment per approved work instructions and travelers

• Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques

• Support engineering builds, process development, and continuous improvement activities, as needed

Inspection, Testing & Quality

• Conduct visual inspection of assemblies under microscope to applicable MIL STD-883 workmanship criteria

• Perform basic electrical “go / no go” and at times more advanced testing using standard test fixtures and equipment

• Identify, document, and report nonconforming material or process issues

• Maintain accurate production records, travelers, and inspection results using our ERP system and shop floor interface

Handling, Packaging & Workflow

• Package finished assemblies per work instructions and cleanliness requirements

• Maintain material traceability and proper part identification throughout the process

• Follow cleanroom protocols, including gowning, tool control, and housekeeping standards

• Work effectively within a team environment to meet production schedules and quality goals

 

Qualifications & Skills

• High School / GED or Technical trade school

• 2-3 years’ experience in a manufacturing or technical environment.

• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired)

• Ability to work under a microscope and handle small, delicate components

• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments

• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions

• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs. 

 

Misc.

• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs. 

• These activities are performed in a clean room environment which is temperature and humidity controlled.

• This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include: 

Hand Hygiene, Personal Item Removal, Gowning Area Preparation, 

Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns, Gloves, Additional Garments, Final Inspection and maintaining proper protocols.

Employment Type: Full Time
Years Experience: 1 - 3 years
Bonus/Commission: No