Advanced Lead - SiC/GaN Power Module Packaging Engineer

Job Description Summary At GE Aerospace, we believe the world works better when it flies. We are a world‑leading provider of jet engines, components, and integrated systems for commercial and military aircraft. The Advanced Lead – SiC/GaN Power Module Packaging Engineer will focus on the design of power modules and the development, optimization, and implementation of manufacturing processes for both GaN and SiC power modules. These advanced semiconductor power modules are critical for high‑efficiency, high‑power‑density power electronics. Role & Responsibilities Power Module Design and Simulation Collaborate with the power module design team to provide insight on module performance using simulation tools. Work with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs. Process Development Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing. Process Optimization Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production. Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance. Quality Control Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements. Conduct root cause analysis and implement corrective actions for process‑related quality issues. Documentation and Reporting Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and SOPs. Prepare technical reports and presentations to communicate process development and improvement activities. Training and Support Train production staff on new processes and equipment. Provide technical support to production teams to resolve process‑related issues. Safety and Compliance Ensure all manufacturing processes comply with safety regulations and company policies. Participate in regular safety audits and risk assessments to identify and mitigate potential hazards. Required Qualifications Master’s degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field. Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging. Desired Qualifications PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field. Experience with GaN and SiC power module manufacturing and packaging technologies. Familiarity with industry standards and regulations related to power electronics. Strong knowledge of semiconductor fabrication processes, materials, and equipment. Excellent problem‑solving and analytical skills. Strong communication and interpersonal skills. Ability to work collaboratively in a cross‑functional team environment. Additional Information GE Aerospace will not sponsor individuals for employment visas, now or in the future, for this job opening. Ability and willingness to sit onsite at our Pompano Beach, FL facility location. Benefits Medical, dental, and vision insurance that begins on the first day of employment. Permissive time off policy for newly hired employees. Generous 401(k) plan. Tuition reimbursement. Life insurance and disability coverage. Paid parental leave, adoption assistance, and paid time off for vacation or illness. Access to Health Coach and Employee Assistance Program. Retirement savings plan with company matching and additional contributions. Relocation Assistance Provided: Yes. Equal Opportunity Employer Statement GE Aerospace is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, protected veteran status or other characteristics protected by law. GE Aerospace will only employ those who are legally authorized to work in the United States for this opening. Any offer of employment is conditioned upon the successful completion of a drug screen (as applicable). #J-18808-Ljbffr