Senior Printed Circuit Board (PCB) Designer

Own complex Printed Circuit Board (PCB) layout from engineering requirements through design release, including component placement, signal routing, power distribution, layer stack-up, controlled impedance, and high-density interconnect design. Partner closely with electrical, mechanical, manufacturing, and other engineering disciplines to translate schematics and system requirements into robust, manufacturable PCB designs. Develop and maintain PCB layouts using Electronic Computer-Aided Design (ECAD) tools such as Cadence Allegro, applying appropriate design constraints, routing practices, and library content throughout the design. Perform and support PCB design reviews, including Design Rule Check (DRC) closure, stack-up and material review, mechanical clearance verification, controlled-impedance requirements, and documentation of design-specific requirements. Collaborate with PCB fabrication and assembly suppliers to address Design for Manufacturability (DFM) requirements, incorporate fabrication feedback, and produce complete manufacturing release packages. Improve PCB design methodologies, libraries, workflows, and automation to increase design quality, consistency, reuse, efficiency, and scalability across hardware-development programs. Bachelor's Degree in Electrical Engineering, Computer Engineering, or related field AND 5+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, or related field AND 3+ years technical engineering experience OR equivalent experience. These requirements include, but are not limited to the following specialized security screenings: Citizenship & Citizenship Verification: This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations (ITAR) or Export Administration Regulations (EAR), the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their U.S. permanent residency or other protected status (e.g., under 8 U.S.C. § 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable. Ability to leverage Artificial Intelligence (AI) tools to drive innovation and efficiency, including engineering research, design analysis, documentation, workflow optimization, and day-to-day task automation. Bachelor's Degree in Electrical Engineering, Computer Engineering, or related field AND 8+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, or related field AND 6+ years technical engineering experience OR equivalent experience. Experience using schematic and board layout tools to deliver complex, multi-layer PCB designs through fabrication and assembly release. Experience applying controlled-impedance, differential-pair, mixed-signal, grounding, and return-path constraints in PCB layouts. Knowledge of PCB stack-ups, materials, via structures, component placement, mechanical constraints, and design for manufacturability. Experience collaborating across electrical, mechanical, systems, verification, and manufacturing disciplines through the hardware development lifecycle. Experience using Cadence ECAD tools such as Allegro PCB Designer Experience designing electronics for cryogenic, low-noise, radio-frequency, precision-measurement, or other demanding operating environments. Familiarity with quantum hardware, control or readout electronics, cryogenic electronics, or other advanced instrumentation systems. Experience with signal-integrity or power-integrity analysis and incorporating simulation results into board revisions. Experience with design for manufacturing and design for test, rigid-flex construction, advanced laminates, microvias, or high-density interconnect technologies. Experience preparing fabrication and assembly documentation and collaborating with PCB fabrication and assembly suppliers. Experience maintaining shared ECAD component libraries and validating schematic symbols and PCB footprints for reuse across hardware designs. Experience supporting board bring-up, verification, failure analysis, and corrective design changes. Role context: This role type exists to bridge high-level system requirements and physical hardware realization within engineering organizations. Positioned between schematic designers, mechanical engineers, and manufacturing partners, the function ensures complex electronic architectures are translated into manufacturable printed circuit board layouts. By managing physical placement, high-density interconnect routing, and signal integrity constraints, professionals in this position enable reliable hardware execution. They serve as a critical operational link that transforms theoretical circuit definitions into validated, deployable physical modules across development cycles. Quantum ecosystem relevance: The role contributes to enabling infrastructure for quantum computing platforms by providing specialized printed circuit board designs required for cryogenic, low-noise, and radio-frequency control systems. Quantum hardware relies heavily on customized control and readout electronics that operate in demanding physical environments. By designing high-density, controlled-impedance boards capable of interfacing with cryogenic instruments and sensitive signal paths, professionals in this function help maintain the structural and electrical foundation necessary to operate quantum processors and advanced instrumentation reliably. Capability signals: Mastery of complex multi-layer printed circuit board layout design and physical routing constraints Deep understanding of signal integrity, controlled impedance, and high-density interconnect routing methodologies Cross-disciplinary collaboration with mechanical, electrical, and manufacturing engineering teams during system bring-up Expertise in preparing complete manufacturing release packages and resolving vendor fabrication feedback Proficiency with Electronic Computer-Aided Design tools and maintaining shared component design libraries #J-18808-Ljbffr Microsoft