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Lead IC Packaging Architect — 3D/2.5D, Data Center ICs

Qualcomm

A leading technology company is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role focuses on spearheading new product introductions particularly targeting Data Center AI and Power Management. Responsibilities include overseeing high-volume manufacturing transitions and driving innovation from concept to production. The ideal candidate will have extensive experience in packaging methods and collaborate with multi-disciplinary teams to solve complex technical challenges. Competitive salary and benefits are offered. #J-18808-Ljbffr Qualcomm

Vacancy posted 3 days ago
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