Process Engineer, Dry Etch

Dry Etch Process EngineerThe Dry Etch Process Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications.Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments and adjust or optimize processes for Fab Operation.Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality.Guide and assist Process Technicians through challenging process steps.Analyze metrology results and disposition lots based on data and pass/fail criteria.Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team.Provide effective pass-downs to support uninterrupted operation for Dry Etch activities.Sustain and improve processes for wafer fabrication.Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality, and product yields.Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment.Assure that the manufactured products conform to specifications and application requirements.Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations.Sustain existing processes in the areas of, Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), Microwave Ashing, Transformer Coupled Plasma etching (TCP), Dipole Ring Magnetron etching (DRM) and Barrel etching, etch process recipe creations, inspections, defects control, and standard Dry Etch related metrology such as ellipsometry or profilometry.Create and maintain operating specifications for production processes and equipment.Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans.Processing experience in a fab in the area of Dry Etch processing using Reactive Ion Etching (RIE), Deep RIE (DRIE), Magnetron RIE (MRIE), Inductively Coupled Plasma etching (ICP), and Microwave AshingExperience with Statistical Process Control (SPC)Basic understanding of algebraic conceptsData extraction, analysis, and reporting experienceBasic understanding of Semiconductor processingAbility to troubleshoot basic problems and address root causesAbility to understand all maintenance activity details required to ensure a healthy and repeatable processAbility to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelinesAbility to operate processing tools, write and run Dry Etch recipes, inspect wafers under the microscope, and perform basic characterization related to Dry Etch processing with particles / defects metrology, and thickness / uniformity metrologyMust be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays).BS in Electrical Engineering, Material Science, Physics, Chemistry, or related + 9 years, MS + 7 years, or Ph.D. + 4 yearsHands-on mindsetExcellent Communication skillsCollaborationQuick LearnerStrong interpersonal skillsSelf-starterPrioritizationAccountabilityInnovative80%+ of work is performed in the Fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected.Frequently in a stationary position, often sitting and/or standing for prolonged periods (3 hours)Frequently viewing a computer monitor for prolonged periods (3 hours)Frequently walking around the Fab for prolonged periods (3 hours)Occasionally required to push and/or pull 50+ lbs objects, such as tool componentsOccasionally required to lift 50+ lbs and occasionally carry that amount short distances (# ft)Occasionally required reach, bend, twist, squat, kneel, and stoop to access and work on tools in the FabMay often require repetitive motions involving the wrists, hands, and/or fingersMay require different positions and motions in tight and confined spacesOccasionally required to handle items using small ranges of motion (e.g. fingers and hands) and large ranges of motion (e.g., full-arms and shoulders) for carrying cassettes and lot boxesConstantly required to wear PPEAt Skorpios, you will be at the forefront of the silicon photonics revolution. We offer the chance to work on truly disruptive technology that is changing how the world connects. You will be part of a team where technical excellence is celebrated and where your contributions have a direct impact on the success of our next-generation product lines.Skorpios offers an excellent benefits package which includes:Competitive salaryMedicalDentalVision401(k)Company paid Life InsuranceCompany paid DisabilityPaid HolidaysPaid VacationGym Membership DiscountsThis position is located at a facility that operates under International Traffic in Arms Regulations (ITAR). All applicants must be 'U.S. persons' within the meaning of ITAR. ITAR defines a 'U.S. person' as a U.S. Citizen, U.S. Permanent Resident (i.e., 'Green Card Holder'), Political Asylee, or Refugee.Skorpios Technologies, Inc. is an Equal Opportunity Employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity or expression, national origin, ancestry, age (40 and over), physical or mental disability, medical condition, genetic information, marital status, military or veteran status, protected leave status, or any other characteristic protected by applicable federal, state, or local laws.As a federal contractor, Skorpios Technologies, Inc. takes affirmative action to employ and advance in employment qualified minorities, women, protected veterans, and individuals with disabilities. We encourage all qualified candidates to apply.Skorpios Technologies, Inc. is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans in our job application procedures. If you need assistance or accommodation due to a disability, you may contact us at or View email address on click.appcast.io is primarily performed in a temperature-controlled, open cubicle setting. Frequent interruptions and conversational noise can be expected. This role may also require occasional work in a manufacturing or cleanroom environment.Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees.Skorpios embraces a Total Compensation philosophy that includes a base salary and eligibility for overtime for non-exempt roles.We offer a comprehensive and competitive benefits package designed to support employee health, welfare, and retirement. Highlights include healthcare benefits, a 401(k) savings plan, and paid time off.Expected salary range: $100,000–$150,000, depending on qualifications and experience.The actual starting rate will be determined based on role-related criteria, level hired in at, including educational qualifications or equivalent experience, relevant work history, and the skills required for the role.