Associate Director, Engineering (Microelectronics) Jobs

Engineering Project LeaderAdvanced Technology is seeking a multi-disciplinary Engineering Project Leader that is responsible for the strategy and development of a microelectronics packaging portfolio that includes the development and use of 2.5D and 3D heterogeneous integration (3DHI) to increase the functional density of RF and mixed-signal sub-systems. In this role, a successful candidate will provide technical direction and expertise during new program capture and execution of Contract Research and Development (CRAD) programs, as well as working across the Raytheon enterprise to support further maturation and transition into operational programs. Additionally, you will identify strategic product development opportunities and propose/coordinate Independent Research and Development (IRAD) projects across programs and product lines. You will work closely with engineers across technical disciplines, and will be highly visible, influential, and accountable within Raytheon's programs and leadership community. This position is onsite and can be located at Tewksbury, MA; McKinney, TX; or Goleta, CA.What You Will DoWork closely with the Senior Leadership and integrated functional teams to develop new business capture strategies and then lead the capture and management of the resulting projects.Perform regular customer interactions to develop strategic and emerging microelectronic packaging opportunities, white papers and proposals.Align the program teams to customer priorities through requirements development, mission analysis, shaping, and pre-design to provide clear direction and actively manage risk mitigation strategies and capture program opportunities.Lead trade studies to consider 2.5D and 3D integration strategies using monolithic and chiplet-based architectures to meet system needs.Lead/manage interposer fabrication and assembly strategy that spans multiple Raytheon manufacturing sites and 3rd party suppliers.Lead technical white papers and proposal volumes through cross-organizational collaboration to deliver customer-focused and high-scoring content.Guide, apprentice, mentor, and train employees within the RF, mixed-signal, system integration and packaging technical domains.Responsible for management and reporting of portfolio investment budget.Travel for customer engagements.Qualifications You Must HaveTypically requires Bachelor's degree in Science, Technology, Engineering, or Mathematics (STEM) and minimum of 12 years of prior relevant experience.Experience with microelectronics design and development with emphasis on microelectronics packaging.Experience writing and/or leading responses to solicitations (RFIs, RFPs, etc.), including white papers and/or proposals.Experience managing program cost, schedule, and technical performance.Experience leading cross-functional teams including, but not limited to principal investigator, engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations.Active and transferable Top Secret U.S. government issued security clearance is required prior to start date with the ability to obtain a Top Secret/SCI clearance and/or program access after start.What We OfferOur values drive our actions, behaviors, and performance with a vision for a safer, more connected world. At RTX we value: Safety, Trust, Respect, Accountability, Collaboration, and Innovation.Relocation eligible - Relocation assistance is available for this position.