Fab Process Engineering Lead, Raxium

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience. 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.). 7 years of technical leadership experience. Minimum Qualifications

Master's degree in Electrical Engineering, Physics, Materials Science, Chemistry or a related field or equivalent practical experience. 10 years of experience in semiconductor process engineering in semiconductor wafer fab manufacturing (e.g., patterning and lithography, wafer bonding and CMP, wet chemical processes, plasma processing, etc.). 7 years of technical leadership experience. Preferred Qualifications

Ph.D in Electrical Engineering, Physics, Materials Science, Chemistry or a related or field equivalent practical experience. Black belt of six sigma practitioner. 15 years of experience in semiconductor process engineering in high-volume semiconductor wafer fab manufacturing. Experience in device fabrication and process integration of semiconductor optoelectronics devices. Fab technical leadership experience defining the process robustness strategy and execution, managing engineering cross-functions, influencing senior stakeholders, and managing executive communication. Expertise in structured problem-solving, data query and analysis.

#J-18808-Ljbffr