Silicon (IC) Design Architect - Advanced Semiconductor Technology

Job Description

Job Description

Silicon (IC) Design Architect – Advanced Semiconductor Technology

Location: Palo Alto, California or Albany, New York (On-site)

Industry: Advanced Semiconductors / Mixed-Signal IC Design

Company: Confidential, Stealth-Mode Venture

Recruiting Firm: Leadingedge Technology Search

The Opportunity

We are conducting a confidential search for a well-funded, stealth-mode semiconductor technology company backed by top-tier investors.

The company is developing a next-generation semiconductor platform and expanding its engineering organization. We are seeking an experienced Silicon (IC) Design Architect to lead the architecture, integration, development, and successful tapeout of advanced custom integrated circuits.

This is a senior technical leadership opportunity for an accomplished IC architect with deep expertise in analog, mixed-signal, high-voltage, power management, and digital semiconductor design.

The successful candidate will work closely with systems, circuit design, packaging, and validation engineering teams to define silicon architectures, drive chip-level integration, and deliver first-pass silicon success.

This position offers significant technical ownership, the opportunity to build and lead a silicon engineering team, and meaningful equity in an early-stage technology company.

What You'll Do

• Lead chip-level architecture and integration for advanced mixed-signal ASICs, high-voltage drivers, analog front ends, and power management ICs.
• Translate system-level requirements into silicon architectures, detailed block specifications, and design requirements.
• Evaluate and select semiconductor process technologies, including standard CMOS, BCD, and high-voltage CMOS.
• Define custom silicon versus licensed IP and commercially available component strategies.
• Own die-level floorplanning, pad rings, bump maps, and chip-to-chip interfaces.
• Collaborate with advanced packaging teams on multi-die integration, interconnects, and package-level design constraints.
• Develop high-voltage isolation, ESD protection, noise partitioning, and power integrity strategies.
• Lead top-level chip integration, including power distribution, clocking, reset, analog/digital interfaces, and timing.
• Define design-for-test (DFT), silicon validation, and debugging strategies.
• Drive technical design reviews, tapeout readiness, and final design sign-off.
• Work with silicon validation, test, and firmware teams on bring-up, characterization, and troubleshooting.
• Provide technical leadership to internal engineering teams and external semiconductor design partners.
• Help establish scalable silicon design methodologies and engineering best practices.

Qualifications

Required

• MS or PhD in Electrical Engineering, Microelectronics, or a closely related field.
• 7+ years of semiconductor IC design experience, including technical leadership of complex mixed-signal ASIC or SoC development.
• Demonstrated ownership of at least one mixed-signal IC or SoC from initial architecture and specification through tapeout and production.
• Strong experience with chip-level architecture, top-level integration, floorplanning, and pad-ring design.
• Deep understanding of analog, mixed-signal, and digital IC design methodologies and trade-offs.
• Experience with high-voltage circuits, power management, or complex analog interfaces.
• Knowledge of design-for-test, silicon verification, bring-up, and post-silicon debugging.
• Experience collaborating with semiconductor packaging and physical design teams.
• Strong technical problem-solving skills and demonstrated ability to resolve complex engineering challenges.
• Excellent communication, cross-functional collaboration, and technical leadership capabilities.
• Comfortable operating in a fast-paced, highly innovative startup environment.

Preferred Experience

Candidates with experience in one or more of the following areas are particularly encouraged to apply:

• Mixed-signal ASIC and SoC architecture
• Analog front-end (AFE) design
• High-voltage CMOS and BCD process technologies
• Power management ICs (PMIC)
• Memory controllers, nonvolatile memory, and integrated high-voltage drivers
• Multi-die, chiplet, and system-in-package architectures
• Advanced 2.5D and 3D semiconductor integration
• Die-to-die interfaces, including UCIe
• Custom silicon development and IP integration
• High-performance computing and advanced semiconductor systems
• Silicon validation, characterization, and first-silicon bring-up
• Leading multidisciplinary silicon design teams
• Experience developing semiconductor products in early-stage or rapidly growing technology companies

Why Consider This Opportunity?

• Join a well-funded, stealth-mode semiconductor technology company backed by top-tier investors.
• Help define the architecture of a next-generation semiconductor platform.
• Take ownership of custom silicon development from initial concept through tapeout and validation.
• Work alongside highly accomplished engineers, scientists, and technology innovators.
• Influence critical architectural decisions and future product development.
• Play a key role in building and growing a world-class silicon engineering organization.
• Competitive compensation, comprehensive benefits, and meaningful early-stage equity.
• Opportunity for significant technical impact and long-term career growth.

Compensation & Benefits

Competitive base salary commensurate with experience and seniority, meaningful equity participation, comprehensive health benefits, paid time off, and additional benefits.

Confidential Search: Leadingedge Technology Search is managing this search on behalf of a privately held semiconductor technology company. Additional company information will be shared with qualified candidates during the interview process

Stealth-Mode Start-Up backed by Tier 1 investors

Company Description

Stealth-Mode Start-Up backed by Tier 1 investors