IC Package Design Engineer - SI/PI for SoC & RF
$171.6k - $302.2kApple Oakbrook
Apple Inc. is seeking a Package Design Engineer in Los Angeles, California, to lead the physical design and integration of semiconductor packages. The role involves optimizing package architecture, collaborating with various teams, and employing AI tools for design efficiency. Candidates should have a BS with 10+ years in the industry and expertise in IC package design with tools like Cadence Allegro and Mentor Xpedition. Apple offers a competitive salary ranging from $171,600 to $302,200, alongside comprehensive benefits including stock options and reimbursement for educational expenses. #J-18808-Ljbffr
Vacancy posted 1 day ago
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