Lead Equipment Development Engineer, Advanced Packaging
Micron Technology Inc
Micron Technology, Inc in Boise, Idaho is seeking a Senior Equipment Technical Leader for advanced packaging development. The role requires a Master's degree or PhD, alongside significant experience in semiconductor equipment engineering. Responsibilities include managing equipment programs that shape next-generation bonding and assembly processes. Micron offers competitive benefits aimed at personal wellbeing and professional growth, including medical, dental, and vision plans, paid time-off, and a paid family leave program. #J-18808-Ljbffr
Vacancy posted 11 hours ago
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