Packaging Process Engineer - Advanced Semiconductors
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Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) team in Chandler, AZ seeks a Packaging Module Development Engineer to develop, optimize, and qualify advanced semiconductor packaging processes for high-volume production.
You will lead experiments, specify materials and equipment, and collaborate with manufacturing and product teams to enable reliable, cost-effective packaging solutions.
#J-18808-Ljbffr Jobleads-USVacancy posted 1 day ago
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