PCB Rework Technician

Job Duration: 8-12 - month contract (Possibility for extension) Job Location: Onsite Sunnyvale, CA Details: Job Overview We are seeking a highly skilled PCB Rework Technician specializing in fine-pitch micro-soldering to join our hardware engineering team. In this role, you will be responsible for precise assembly, modification, replacement, and repair of complex Surface Mount Technology (SMT) and Through-Hole (TH) printed circuit board assemblies. You will work extensively under high-magnification microscopes to execute delicate micro-soldering procedures on high-density assemblies. Key Responsibilities Micro-Soldering & Rework: Perform precision hand soldering, desoldering, component replacement, and rework on fine-pitch components (including 0201/01005 passives, QFNs, BGAs, WLCSPs, and ultra-fine pitch ICs). BGA Rework & Inspection: Operate BGA rework stations for component removal, reballing, site preparation, and alignment. Utilize X-ray inspection equipment to verify solder joint integrity, voiding, and alignment. PCB Repair: Execute advanced trace repair, pad restoration, wire jumper installation, and ground plane repair using micro-drilling and conductive adhesives/epoxies where necessary. Inspection & Quality Assurance: Inspect PCBA work using high-magnification stereomicroscopes and optical inspection tools in strict accordance with IPC-A-610 and IPC-7711/7721 standards. Prototyping & Modifications: Support engineering teams by performing manual ECO (Engineering Change Order) modifications, jumper wire additions, and component swaps on prototype boards. Equipment Maintenance: Maintain and calibrate precision soldering irons, hot‑air rework stations, preheaters, micro‑tweezers, and ESD‑safe workstation gear. Documentation: Track rework history, defect logs, and yield metrics in the ERP/MES system. Qualifications & Requirements Experience: Minimum 3–5+ years of hands‑on experience in precision PCB rework and micro‑soldering within an electronics manufacturing, hardware R&D, or repair environment. Certifications: Current or past IPC‑A‑610 and/or IPC‑7711/7721 certifications strongly preferred (J‑STD‑001 is a plus). Technical Skills: Proficiency in working under continuous stereo microscope magnification. Expert‑level micro‑soldering skill using hot air tools, micro‑tweezers, thermal strippers, and specialized solder tips. Demonstrated capability to rework 0201/01005 components, BGA/QFN packages, and 0.4mm pitch ICs. Experience reading and interpreting engineering schematics, assembly drawings, bill of materials (BOM), and ECO documentation. Physical & Aptitude Requirements: Excellent manual dexterity, steady hands, strong spatial reasoning, and visual acuity for fine detail. Good communication skills and the ability to work in a fast‑paced engineering environment. ESD Knowledge: Deep understanding of Electrostatic Discharge (ESD) prevention protocols and safe handling of sensitive semiconductor components. Preferred Qualifications Familiarity with basic hardware troubleshooting. Ability to use CAD/board viewing software (e.g., Allegro, Altium, or similar). Experience with automated optical inspection (AOI) or X‑ray inspection systems. Background in high‑reliability industries such as aerospace, medical device, defense, or automotive electronics. Familiarity with conformal coating removal and re‑application techniques. EEO: “Mindlance is an Equal Opportunity Employer and does not discriminate in employment on the basis of – Minority/Gender/Disability/Religion/LGBTQI/Age/Veterans.” #J-18808-Ljbffr Mindlance