System Design Engineer

San Francisco Bay Area, California, United States Hardware Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. In this role, you will own and drive the electrical and physical design of multi-layer boards for prototype systems, developing reference designs that meet stringent area, cost, and performance requirements for product development. Description Work with cross-functional team to understand system requirements, from both physical design limitations and performance requirements Develop physical design implementations meeting stringent power and signal integrity requirement Drive co-optimization of physical design on MLB and package Provide implementation guidelines and feedback to silicon, package, and system design groups Perform feasibility study, design verification, and sign-off. Responsibilities Create custom PDN and SI routing feasibility on the system level for product PI/SI performance verification and help develop droop requirements for the system. Work with cross functional teams to incorporate requirements and system constraints to MLB routing feasibility layouts. Use BKM to create layouts satisfying droop requirements for PI. Work with Package team on codesign areas between MLB and Package design. Minimum Qualifications BS and 10+ years of relevant industry experience Preferred Qualifications 4+ years experience in physical design of multi-layer boards (MLBs). Experience in circuit design, schematic capture, and system integration. Strong physical understanding of power and signal integrity fundamentals. Experience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level. Familiar with Cadence APD/Allegro for physical design. Familiar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies. Ability to work and communicate effectively in a multi-functional team. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $181,100 and $318,400, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant. Apple accepts applications to this posting on an ongoing basis. #J-18808-Ljbffr Apple Inc.