Lead Principal Engineer, Die-to-Wafer Hybrid Bonding

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Intel Corporation in Hillsboro, Oregon seeks a Principal Engineer to define and scale next‑generation die-to-wafer hybrid bonding technologies for advanced packaging. You will drive technology roadmaps, mentor staff, and partner with equipment vendors to deliver robust, manufacturable solutions across TD and HVM environments.

You will contribute to process development, yield improvement, and reliability enhancements while aligning technical strategies with corporate goals and cost efficiency.

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Vacancy posted 15 hours ago

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