Senior Electronics Quality Engineer

pay

Required Skills
IPC 610 & IPC 620 Inspection
PCB CAM & Gerber Review
SMT/AOI Defect Analysis
Counterfeit Parts Detection (AS6081)
Semiconductor Package Inspection (C SAM and X ray)
About micro1
micro1 is the leading AI data lab for training frontier models and evaluating AI agents. Experts contribute their diverse subject matter knowledge across domains such as finance, healthcare, STEM engineering, and more. micro1 transforms that real-world expertise into high-quality training data, evaluations, and feedback loops that improve how AI systems learn, reason, and perform.

Our platform identifies and vets top talent through an AI recruiter, enabling high-quality expert contributions at scale. We aim to enable 1 billion people to do meaningful work by applying their expertise to AI. As our global expert network grows, micro1 is building the human intelligence layer for frontier AI.

Role Title: Senior Electronics Quality Engineer

Role Type: Contractor

Location: Remote (US-based preferred)

micro1 is engaging Senior Electronics Quality Engineers to contribute expert knowledge to a customer's project focused on advanced electronics assembly and inspection. In this role, you'll apply your expertise to help train next-generation AI systems. Your work will shape how models learn, reason, and perform through high-quality, real-world input. No prior experience in AI is required — your domain knowledge is what matters.

Scope of Work

Review and evaluate PCB CAM and Gerber files for manufacturability, quality, and compliance with industry standards.
Perform IPC 610 and IPC 620 visual inspections and provide detailed feedback on PCB assembly or wire harness builds.
Analyze and document surface mount (SMT) and automated optical inspection (AOI) defect types, including the identification and root cause analysis of AOI false calls.
Apply expertise in counterfeit electronic part detection aligned with AS6081 standards, delivering actionable insights for risk mitigation.
Conduct and interpret advanced semiconductor package inspections using C-SAM and X-ray imaging, including die inspection and MIL-STD-883 compliance checks.
Prepare concise, well-written reports and articulate findings verbally to both technical and non-technical stakeholders.
Collaborate with project leads to refine workflow processes and enhance training datasets for AI development.

Preferred Qualifications

8+ years of hands-on experience in electronics quality, CAM engineering, or failure analysis, specifically within PCB assembly, wire harness, or semiconductor packaging domains.
Extensive expertise in IPC-A-610 and IPC/WHMA-A-620 inspection criteria; IPC CIS/CIT certification strongly preferred.
Demonstrated experience reviewing Gerber data and utilizing PCB CAM software for manufacturability and quality assurance.
Proficiency in SMT processes, AOI defect analysis, and remediation of false calls in automated inspection systems.
Direct involvement in counterfeit component screening per AS6081, with knowledge of risk indicators and mitigation strategies.
Hands-on skills with semiconductor inspection tools such as C-SAM and X-ray, alongside familiarity with MIL-STD-883 procedures.
Exceptional written and verbal communication skills, ensuring clarity in documentation and knowledge transfer.
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