Senior Staff Process Engineer - Dry Etch

Job Details Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel Foundry Technology Manufacturing (FTM). We bridge the critical gap between Technology Development (TD) and High-Volume Manufacturing (HVM), advancing technology nodes from initial product qualification to high-yield production across multiple products while enhancing technologies for our foundry customers. Intel's Chandler, Arizona facility is constructing state-of-the-art fabrication facilities for cutting‑edge technology nodes, including Intel 18A and beyond. Additionally, we’re developing legacy technologies with foundry partners to launch HVM operations serving global foundry customers. Position Summary We are seeking an experienced Senior Staff Process Engineer – Dry Etch to join our MDCE team and help build a world‑class Foundry Customer Engineering organization. This role focuses on integration and device engineering across various Intel technologies, including 18A, to serve our global foundry customer base. The position requires extensive hands‑on experience with sub‑3nm Gate‑All‑Around (GAA) FETs and front‑end dry etch processing. Key Responsibilities Technology Development & Manufacturing Drive technology development initiatives that enable both high‑volume manufacturing and future technology advancement Provide comprehensive process integration and equipment solutions Conduct feasibility studies to meet target device specifications Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design Process Optimization & Innovation Optimize production output for existing products Partner with key equipment and materials suppliers to develop enabling technology elements Perform process technology feasibility studies using theoretical simulations and practical engineering methods Industry Leadership & Strategic Vision Stay current with industrial process and material manufacturing trends Develop insights into future Intel process technology needs Partner with vendor ecosystem to build cost‑sensitive technology roadmaps Influence and drive technical direction across Intel and the broader industry Technical Leadership & Mentorship Develop and mentor technical leaders within the organization Act as a change agent while modeling Intel values Align organizational goals with technical vision and formulate strategic technical direction Demonstrate proven execution in bringing products and technologies to market Collaboration This role involves close collaboration with Logic Technology Development (LTD) and Technology and Foundry Supply Manufacturing (TFSM) teams to support a comprehensive range of applications and customer requirements Qualifications Minimum qualifications are required to be initially considered for this position. The preferred qualifications are a plus factor in identifying top candidates. Minimum Qualifications Bachelor's degree in Electrical Engineering, Physics, Material Science or in a STEM related field of study 6+ years of relevant work experience in the semiconductor industry with a strong focus on dry etch modules Industry experience in one of the areas noted: process development, leadership, semiconductor process, materials Experience working with or for tool suppliers on solutions for optimization/customization to meet manufacturing needs especially with the industry leaders in dry etch processes such as LAM, TEL, AMAT, and/or Hitachi Extensive experience in fab with technical track record in any one of the areas of semiconductor sector such as research and development, yield improvement and/or defect reductions Preferred Qualifications Advanced degree (MS/PhD) in Electrical Engineering, Physics, Material Science or in a STEM related field of study Experience with factory automation control systems Direct foundry experience in dry etch process development: FEOL, MOL and/or BEOL Hands‑on experience with sub‑3nm Gate‑All‑Around (GAA) FETs Demonstrated success in foundry New Product Introduction (NPI) activities and complex tape‑out troubleshooting Experience in ramp and high‑volume manufacturing environments Experience with industry standards and certifications Experience with device parametric data generation and analysis Knowledge of Design of Experiment (DOE) principles and engineering data analysis tools Experience in product data interpretation, root cause analysis, and solution development Why Join Intel MDCE? Intel offers an exceptional opportunity to work with cutting‑edge technology in a collaborative and innovative environment. This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high‑volume manufacturing. Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader. Impact & Growth Join a team that's reshaping Intel's foundry capabilities and directly influencing the success of next‑generation semiconductor technologies. This role offers exceptional opportunities for professional growth, technical leadership, and meaningful impact on Intel's strategic objectives in the foundry market. Job Type Experienced Hire Shift Shift 1 (United States of America) Primary Location US, Oregon, Hillsboro Additional Locations US, Arizona, Phoenix Business Group Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers – from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembles/test packages the compute devices to improve the lives of every person on Earth. Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $155,520.00 - 298,440.00 USD Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on‑site at their assigned Intel site and off‑site. Job posting details (such as work model, location or time type) are subject to change. ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. #J-18808-Ljbffr Intel