Principal Physical Design Engineer

Principal Physical Design Engineer

• RTL-to-GDSII Execution: Own physical implementation of System-on-Chips (SoCs) or complex digital blocks.
• Design Optimization: Manage floor-planning, bump planning, power grid design, and clock tree synthesis (CTS) to optimize chip performance.
• Design Convergence: Resolve timing, congestions, EM/IR issues together with Frontend Designers
• Signoff & Verification: Run Static Timing Analysis (STA) and physical verification. Fix Design Rule Checking (DRC) and Layout Versus Schematic (LVS) violations.
• Methodology Development: Drive automation and improve flow robustness using scripting languages like Tcl, Python, or Perl.
• Cross-Functional Leadership: Partner with architects, logic designers, and analog design team for tapeout readiness.

Key Qualifications

• Experience: 7+ to 15+ years of relevant ASIC physical design experience (depending on degree level).
• Process Knowledge: Deep tapeout experience in advanced technology nodes (e.g., 7nm, 5nm, 3nm).
• Tool Mastery: Advanced proficiency with industry-standard EDA tools from vendors like Cadence (e.g., Innovus, , Tempus, Voltus, Pegasus, Calibre).
• Technical Concepts: Expertise in physically aware synthesis, power domain analysis, and Electromigration/IR-drop (EM/IR) cleanup.

Annual Base Salary Range: $200,000 to $300,000 (The final offer will be determined based on job-related skills, experience, qualifications, and location.)