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Senior Mechanical Modeling Architect — Advanced Packaging

Advanced Micro Devices Inc

AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define and drive next-generation packaging-platform architectures, using rigorous model-based decisions to guide electro-thermal and electro-optical integration across package, board and cooling solutions. The ideal candidate leads with autonomy, collaborates across silicon, package, thermal, optical, and system teams, and influences product roadmaps for data center HPC systems. #J-18808-Ljbffr AMD

Vacancy posted 4 days ago
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