Senior ASIC Package Design Architect - FC‑BGA & MCM

K2Spacecorporation in Seattle is seeking a Principal ASIC Package Design Engineer to lead the development of advanced ASIC packages. You will focus on flip-chip BGA and multi-chip module solutions, ensuring high-performance and reliability in designs. This role requires over 10 years of experience in ASIC package design and a strong educational background in relevant engineering fields. Join a cutting-edge space startup and contribute to revolutionary satellite technology. #J-18808-Ljbffr K2Spacecorporation