Packaging Design Architect

Responsibilities Drives end-to-end development for substrate design from concept through tape out Implements physical layout and routing of the package design Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs Works closely with silicon and hardware teams to optimize silicon-package-board performance and pinout Defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves DRCs to optimize package design Completes documentation and collateral into the product lifecycle management system of record Requirements Ph.D./master’s in electrical engineering/ chemical engineering/ mechanical engineering or Material Science 10+ years and in-depth knowledge/background in Package, PCB design, or IC digital design Solid background in semiconductor fabrication and packaging Strong analytical ability and problem-solving skills: identifying, isolating, and debugging issues and providing creative solutions Experience with design and electromagnetic simulation tools: Mentor, Cadence tools, SPICE, Ansys tools etc. Experience in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP, Concept HDL, Sigrity), and/or Mentor Xpedition platform tools (PCB Layout/XPD, Designer, Hyperlynx) #J-18808-Ljbffr Jobtailor