Sr Manager Design Development Technical Leadership, HBM

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design Development Technical Lead (DDTL) is accountable for the predictable, timely delivery of HBM design achievements across the design phase of the product lifecycle. This role serves as the single‑threaded technical program owner for HBM Design execution, coordinating across DRAM, base die, test vehicles, interposers, IP, and foundries. Responsibilities Own end‑to‑end execution of on schedule delivery of HBM design achievements, ensuring alignment across stakeholders. Serve as the primary design representative in PDT and executive reviews. Define and manage cross‑functional dependencies, lead execution governance, including DDTL Syncs and Design Program Reviews (DPRs). Own and operate formal Change Control Board (CCB) processes, maintaining a comprehensive design risk register and capturing lessons learned. Drive early engagement during architecture and design phases to enable shift‑left risk mitigation and lead initiatives to optimize die size, DFM, yield, cost, power, and manufacturing efficiency. Ensure HBM products meet best‑in‑class targets for performance, power, quality, reliability, and cost. Lead design‑phase engagement with external foundries and IP providers, managing IP forecasting, selection, prioritization, and contractor procurement. Own design‑phase financial accountability, including IP cost projections, mask cost planning, and alignment with budget and business objectives. Maintain, integrate, and communicate the HBM design roadmap across stakeholders. Capture customer requirements and ensure execution alignment with market priorities. Define, standardize, and deploy program management tools, dashboards, and process metrics to support continuous improvement. Qualifications Understanding of custom and digital design flows and the full SoC/DRAM development lifecycle. Demonstrated ability to lead large, cross‑functional technical programs through influence and rigor. Experience working with foundries, IP vendors, and ecosystem partners. Knowledge of DRAM operation, preferably within the HBM product family. Familiarity with industry standards and compliance requirements (e.g., JEDEC). Preferred Qualifications 10+ years of relevant industry experience. Bachelor’s degree in Electrical Engineering or a related field. Strong analytical, problem‑solving, and decision‑making skills. Experience with formal program or project management methodologies. Strong executive communication skills and ability to operate effectively in a fast‑paced, dynamic environment. Benefits Choice of medical, dental and vision plans with options suitable for families and budgets. Benefit programs that protect income in case of illness or injury, and paid family leave. Robust paid time‑off program and paid holidays. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr 1000 Micron Technology, Inc.