Senior Advanced Packaging Architect: 2.5D/3D ICs
OLIX
OLIX is seeking an Advanced Packaging Architect to own packaging technology direction for the DX-1 accelerator and future products. You will drive package architecture, detailed design, layout, simulation, and product readiness while shaping the strategy and ecosystem for next-generation packaging. In this high-impact role you will lead cross-functional packaging activities, mentor engineers, and build the packaging function as the programme scales. #J-18808-Ljbffr
- ...team is seeking an exceptional DFT Engineer to shape the future of compute. You will design and prototype test architectures for advanced silicon, spanning multi-chiplet designs and large-scale SOCs, from RTL to ATE bring-up. You will own the ATPG lifecycle and mentor...Senior3D
- ...OLIX is seeking an Advanced Packaging Architect to own packaging architecture and roadmap for DX-1 and future products, coordinating with ASIC, optics, mechanical, and systems teams to deliver high-performance packaging solutions. This role combines hands-on design with...Senior3D
- ...Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross...Senior3D
- OLIX Computing Ltd. is seeking an Advanced Packaging Architect to own packaging architecture, roadmap, and execution for the DX-1 decode accelerator. You will shape 2.5D/3D packaging, drive from concept through manufacturing, and define the strategy in collaboration with...3D
- The Semiconductor Packaging Engineer will serve as an experienced technical... ...role provides standard and advanced packaging solutions to support... ....Broad working knowledge of IC package families such as QFP,... ...packaging, panel-level packaging, 2.5D/3D integration, chiplets,...Senior3DFull timeWork at officeLocal area
- ...1) is the first accelerator architected specifically for decode. Rack... ...of logic, data movement, packaging, optics and interconnect enables... ...differentiation. The Advanced Packaging Architect will own... ...chiplet-style integration, 2.5D and 3D architectures, and progressively...3DWork at officeLocal area
$168k - $264.5k
...are seeking an innovative Senior STA Signoff Methodology... ...experiments to model the impact of advanced technologies on chip... ...at 5 nm, 3 nm, 2 nm, and beyond.Familiarity... ...the crowd:Familiarity with 3D IC integration, die stacking and packaging, self-heating, and their...Senior3DFull time$148.7k - $201.2k
...the silicon used in our most advanced machine learning accelerator... ...to learn.We are looking for a Senior Technical Program Manager to... ...Design, DFT, System Validation, Packaging, Quality, Reliability, Supply... ...packaging, chiplets, 2.5D/3D integration, or HBM.- Experience...Senior3DFlexible hours$249.9k - $338.1k
...Job Overview: At Arm an SoC Architect is a technical role responsible for architecting... ..., memory hierarchies, sophisticated 2.5D/3D packaging, performance / power modeling & estimation... ...and 10 years of experience in a senior development or leadership position within...3DWork at officeLocal area- ...AMD is seeking a Package-centric Mechanical Modeling Architect in Austin, TX. You will define and drive next-generation packaging-platform architectures, using rigorous model-based decisions to guide electro-thermal and electro-optical integration across package, board...Senior
- ...a Distinguished Compute Architect to join the CTO Office and... ...and energy efficiency in advanced measurement platforms. As a senior technical leader, you will... ...with OPT or CPT), H-1, H-2, L-1, B, J or TN, or who... ...systems, or advanced packaging. ~ Experience working in...SeniorTemporary workWork at officeFlexible hours
$168k - $264.5k
...innovation for the most advanced silicon in the world—spanning 2.5D/3D AI data center platforms,... ..., automated solutions.Co-architect novel DFT strategies alongside... ...:Experience with 2.5D/3D ICs, multi-chiplet... ...a comprehensive benefits package. At NVIDIA, we work on the...Senior3DFull time- ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology... ...performance, high-complexity package designs in a fast-paced... ...readiness gates.Interface with senior leadership to provide clear program... ...(e.g., chiplets, 2.5D/3D integration).EDUCATION REQUIREMENTS...Senior3D
- ...ICON is looking to add a Senior Architect / Senior Designer to the Design... ...opportunity to work with your team to advance humankind’s ability to... ...development of ICON’s concrete 3D-printed wall system to... ...coordination of comprehensive drawing packages across all design stages,...Senior3DFor contractors
$80k - $104k
...contract deliverables such as diagrams, 3D models, drawings, renderings, physical models... ...the studio and office.Demonstrates an advanced understanding of building materials, systems... ...knowledge, skills and abilities.Licensed Architect required; LEED accreditation preferred....Senior3DFull timeContract workWork at officeFlexible hours- ...AMD in Austin, TX is seeking a highly skilled CAD engineer to advance 3D-IC and advanced packaging flows from RTL to signoff. You will lead hands-on debugging of large netlists and partner with Synopsys and Cadence on AI-enabled CAD solutions. The ideal candidate combines...3D
$185.2k - $250k
...customers change the world.We are seeking a Senior Design Automation Engineer to join... ...contribute to the physical design of advanced IC packages and PCBs for next-generation machine... ...packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and...Senior3DFlexible hours- ...Senior Project Architect As a Senior Project Architect on the Perkins&Will team, your skills and... ...coordination Client communication Software Advanced Revit Conceptual and computational... ...VRay Physical modeling tools such as 3D printing and laser cutting Presentation...Senior3DContract workWork at office
- ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believetechnology... ...performance, high-complexity package designs in a fast-paced... ...readiness gates. Interface with senior leadership to provide clear program... ...(e.g., chiplets, 2.5D/3D integration). EDUCATION REQUIREMENTS...Senior3D
$152k - $242k
...Multiple Open Roles, Principal and Senior Principal levels)Mechanical... ..., subassemblies and packaging for new and existing products... ...technologiesAdvanced proficiency with 3D CAD tools (Creo, SolidWorks, or... ...some of the best minds and most advanced tech in the industry, we’re...Senior3DRelocation package$323k
...outstanding and visionary Lead Architect to drive the definition and... ...innovative solutions—from 3D integration and advance memory systems to emerging... ..., memory technologies, packaging innovations, and heterogeneous... ...architectural vision to senior collaborators and technical...Senior3DWork at officeLocal areaRemote work- ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power... ...industry-leading methodologies for 3D IC stack and advanced packaging design. Our flows encompass 3D netlist... ...Advanced Packaging technologies preferred (2.5D, 3D, 3.5D, including interposers...3D
$203.5k - $275.3k
...accelerator is a multi-die chiplet using state-of-the-art packaging technology, and it is the most complex hardware program... ...qualification - Experience with multi-die / chiplet / advanced packaging programs (2.5D/3D integration).- Familiarity with HBM integration, die-to...3DFlexible hoursShift workDay shift- ...qualification, production ramp and HVM. This senior technical role owns cross-functional... ...test/SLT, yield, reliability and advanced packaging. The successful candidate combines deep... ...and corrective actions.Support advanced 2.5D/3D and chiplet-based productization and establish...3DWork at officeLocal areaRelocation
- ...memories and Serdes, coordinate with vendors, write tests, review designs, and participate in code reviews and cross-functional planning to deliver the next generation ML chip and its 2.5D packaging in a demanding AWS datacenter environment. #J-18808-Ljbffr Amazon Inc.Senior
- ...an exciting opportunity for a Senior Principal Product Engineer in... ...new products in areas such as 2.5D/3DIC and sub-3nm nodes. The... ...cross-functionally with design, packaging, software, silicon validation,... ...skills.Experience with advanced foundry and assembly process.Leadership...SeniorWork at officeLocal areaRelocation
- ...everyone. Your Role In this role, it's your job to lead a team of architects and designers to deliver unparalleled architectural projects.... ...on a variety of project types Expert working knowledge of Revit, 3D modeling, visualization, and graphic software Full knowledge of...Senior3DContract workFor contractorsLive inWork at officeLocal areaRelocation
- 3D-IC Application EngineerAs an Applications engineer with Siemens... ...is also expected to help architect and prototype Siemens EDA's emerging... ....Significant experience in advanced IC Package layout design and/or... ...is preferred.Familiarity with 2.5D and 3D chiplet-based design...3DWork at officeLocal areaWork from home
- ...AMD in Austin, TX seeks a senior advanced packaging technology leader to drive packaging architectures across client, server, gaming and GPU... ...with product design teams and partners to define roadmaps, architect processes, and set DFM/DFY guidelines while guiding cross‑...Worldwide
- ...Supply Chain and Engineering, and Talent, with advanced capabilities in AI and Data, Industry and... ...IT Systems (ERP, PLM, MES, ALM, QMS): 2 years of hands-on experience with Engineering... ...). Bonus points if: Experience with 3D visualization, AR/VR, IoT, Blockchain, compliance...3DFull timeWork experience placementLive inWork at officeLocal area
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