Senior IC Packaging Engineering Leader — Advanced Packaging
Intel Corporation
Intel Corporation in Phoenix, Arizona is searching for a Silicon Packaging Engineering Manager. In this role, you will lead a team responsible for delivering advanced packaging solutions while collaborating with cross-functional teams. The ideal candidate brings extensive experience in IC package design and leadership in the engineering field. This full-time role emphasizes project management and technical expertise across various packaging methodologies. #J-18808-Ljbffr Intel Corporation
Vacancy posted 2 days ago
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