Plating Manufacturing Technician

TITLE: PLATING ME TECHNICIAND SHIFT: FRIDAY THRU SUNDAY AND EVERY OTHER THURSDAY 6:00 PM TO 6:00 AMREPORTS TO: SR. MANAGER, PLATING MANUFACTURING ENGINEERINGSUMMARY:Under the direction of the Sr. Manager of Plating Manufacturing Engineering, the Plating ME Technician provides support to the manufacturing and engineering teams in the plating area, assists and supports wafer fab production, reviews and documents processes or procedures, and dispositions abnormal wafers for rework; maintains process controls using Statistical Process Control (SPC), collects and analyzes data, and recommends corrective action; supports activities related to improved manufacturing efficiency This position is located in Milpitas, California.ESSENTIAL FUNCTIONS:Provides support to the manufacturing and engineering teams in the plating areaSupports wafer fab production and manufacturing processes to ensure that wafers are processed efficiently and cost effectivelyReviews and documents processes and procedures; partners with engineering to implement changes effectively and with minimal disruptionDispositions abnormal or atypical wafers for rework; ensures that rework is completed promptlyCollects and analyzes data and recommends corrective action if requiredReviews and maintains process controls using SPC and prepares charts and graphs as neededAssists with trouble-shooting tools and process issues in the plating areaParticipates in and recommends modifications to procedures or processes in support of continuous improvement initiativesAssists with training and certifying operators on various tools and manufacturing processesCollaborates with manufacturing or engineering to qualify or approve new processes or procedures and may assist with identifying production integration timelinesResponds to inquiries from other team members, managers, or departmentsOvertime may be required contingent on business needsAdheres to all safety policies and procedures as requiredPerforms other duties of a similar nature or level*MINIMUM QUALIFICATIONS:Associates degree in Electronics, Industrial Engineering, or Manufacturing Technology and/or equivalent relevant experienceTwo years of experience working in the semiconductor industry in a high volume manufacturing environmentStrong knowledge of electronics and manufacturing processesProficient in the use of Microsoft Office ApplicationsRequired Knowledge, Skills, and Abilities:Knowledge and ability to use various types of plating tools or wet etch equipmentKnowledge of the semiconductor and hard disk drive industry principles, practices, and techniquesKnowledge of and ability to use MS Office, including Word, Excel, Power Point, and Access to analyze data, create documents, spreadsheets, and presentationsKnowledge and ability to use SPC to maintain process controlsAbility to collect and analyze data using SPC, including presenting findings and recommending corrective actionAbility to troubleshoot various types of tools and tool sets to ensure minimal downtimeAbility to adhere to all safety policies and proceduresAbility to communicate, both verbally and in writing, with contractors, consultants, employees, management, and vendorsDemonstrated ability to problem solveSkilled at time managementSkilled at resolving issues quickly and efficientlyFlexible and able to prioritizeThe hourly rate for this full-time position is between $20.90-$31.35 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The hourly pay range shown is subject to change and may be modified periodically.WORKING CONDITIONS:The Plating ME Technician works primarily in an indoor environment on a rotating schedule on D shift Friday thru Sunday and every other Thursday 6:00 PM to 6:00 AM. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally be required to push, pull, or lift up to 30 pounds.*Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department. #J-18808-Ljbffr Headway Technologies Inc