Thin Films Module Development Engineering

Job Details:Job Description: The Role and ImpactAs a Module Development Engineer, you will play a crucial role in driving advancements in Intel's semiconductor manufacturing technologies. You will focus on developing and optimizing advanced manufacturing processes to enable cutting-edge device architectures. Leveraging your expertise in process integration, equipment solutions, and feasibility studies, you will help shape Intel's future technology roadmap while ensuring robust and scalable solutions for high-volume manufacturing. Your work will directly contribute to Intel's innovation and leadership in the semiconductor industry.Business groupYou will join Intel's Advanced Packaging Technology Development organization, which focuses on creating future generations of packaging technologies to meet Intel's manufacturing and innovation goals. This team develops and enables high-volume manufacturing processes while driving advancements in semiconductor technology to reinforce Intel's leadership position in the industry. Together, the group ensures the successful integration of advanced technologies while delivering solutions that align with Intel's broader vision of technological innovation.Key Responsibilities- Lead the design and development of advanced manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design.- Drive technology development and enablement for both high-volume manufacturing and future technologies.- Conduct feasibility studies and simulations to achieve desired device specifications.- Develop and execute technology roadmaps to guide future manufacturing needs and set industry standards.- Collaborate with equipment and material suppliers to design and implement innovative process technologies.- Optimize production efficiency, manufacturing techniques, and output for existing and new products.- Utilize statistical process control and data analytics to enhance process stability and drive continuous improvements.- Recommend and implement modifications to operational equipment to improve efficiency and scalability.- Partner with cross-functional teams to ensure alignment on process integration and project deliverables.Qualifications:QualificationsMinimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum Qualifications - Bachelor's degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related STEM discipline with 5+ years of relevant experience.- OR Master’s degree in the same fields with 3+ years of relevant experience.- OR PhD in the same fields with 1+ years of relevant experience.Experience listed above should be a combination of the following:- Proven expertise in manufacturing process development, statistical process control, and/or data analytics.- Experience in wafer-level assembly, semiconductor processing, or advanced packaging technology development.- Experience with films processing techniques such as CVD/PECVD, thermal/PE ALD and PVD.Preferred Qualifications - Experience in wafer-level assembly, advanced packaging, or related technologies such as hybrid bonded interconnects.- Demonstrated success in leading programs from strategy formation to high-volume production.- Recognized technical leadership with a proven track record of solving complex engineering challenges.- Strong collaboration skills across functional areas like yield, operations, and supplier management.Intel is looking for innovative engineers who are passionate about advancing semiconductor technology. Bring your expertise and creativity to our team and help shape the future of technological innovation. Apply now to make an impact at Intel.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Oregon, HillsboroAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Oregon, HillsboroType: Full time