Senior Principle Process Engineer, Wire and Ribbon Bonding

**Job Description** Electronic Combat Solutions (ECS) has technology, engineering and program teams that educate and mentor colleagues to deliver leading Electronic Warfare capabilities. We welcome all those who have big ideas, crave innovation, want to drive fielding velocity, and have the passion to bring the warfighter home safe. See what you re missing. Our employees work on the world s most advanced electronics from detecting threats for F-35 pilots to illuminating the night for soldiers. Spanning air, land, sea, and space, we are developing the technology of tomorrow, delivered today. Drawing strength from our differences, we re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first exemplified by our mission: We Protect Those Who Protect Us. Sound like a team you want to be a part of? Come build your career with BAE Systems. Position Summary This position is in the Microwave New Product Introduction (NPI) Pilot Line located in Nashua, NH. The Pilot Line is responsible for the early builds of new electronic and mechanical hardware designs. This includes the development and maturation of the associated build processes, programming, and tooling in preparation for rate production. This requires close collaboration with the design community and requires being able to adapt to a rapidly changing environment. The NPI Pilot Line plays a critical, exciting, and unique role that helps ensure that future production runs are successful. In this Principal Process Engineer role you will make impacts in the following ways; + Work with automated and manual wire and wedge bonding machines, including process development, programming, and optimizing. + Provide Process Engineering floor support, guidance, and instruction to operators in support of Microwave module assembly including substrate lamination, component placement, wire bonding and inspection. + Perform manufacturing support activities using technical knowledge of generally used assembly practices ensuring the achievement of performance within cost and schedule requirements. + Support Preliminary Material Review/Material Review Board (PMR/MRB) for the disposition of discrepant material and determination of root cause/corrective action. + Perform quality audits of hardware, PFMEA s, monitor defects, and track trends. + Support/Lead factory continuous improvement activities and projects. + Perform coaching, training, and qualification for operators. + Ensure timely disposition of hardware and assure thorough root cause analysis of discrepant materials. + Create and maintain process documents that will be followed on the factory floor. + Create and maintain production routers for material moving through the factory. + Maintain assigned projects and tasks to ensure timely completion of required needs. Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full- time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time. **Required Education, Experience, & Skills** + Bachelors Degree in Engineering or in a related field + 8 years work experience in a technical field + 3 years' experience in wire/wedge bonding microelectronic subassemblies, preferably in programing autobonders + Process or manufacturing engineering background with strong analytical, problem-solving, and interpersonal skills, have proven teamwork and leadership skills, and be able to work across boundaries with multiple functions and program teams + Exhibit sound interpersonal skills involving interfacing, coordinating and negotiating with company personnel at all levels, customers and suppliers + Effectively communicate status on technical aspects of manufacturing in program production meetings + Ability to understand, analyze, and resolve complex technical problems + Ability to work self-directed + Communicate effectively both orally and in writing + Must be proficient in Microsoft Word and Excel **Preferred Education, Experience, & Skills** + Active DOD Secret Security Clearance + PPV/FAI industry experience + Statistical Analysis including SPC, CpK, DOE + Root Cause and Corrective Action methodology + Green Belt and Lean manufacturing training and demonstrated ability to apply these principles + Familiarity with IPC and Mil-Stds + Prior experience working within a DoD environment + Development of software tools **Pay Information** Full-Time Salary Range: $132962 - $226035 Please note: This range is based on our market pay structures. However, individual salaries are determined by a variety of factors including, but not limited to: business considerations, local market conditions, and internal equity, as well as candidate qualifications, such as skills, education, and experience. Employee Benefits: At BAE Systems, we support our employees in all aspects of their life, including their health and financial well-being. Regular employees scheduled to work 20 hours per week are offered: health, dental, and vision insurance; health savings accounts; a 401(k) savings plan; disability coverage; and life and accident insurance. We also have an employee assistance program, a legal plan, and other perks including discounts on things like home, auto, and pet insurance. Our leave programs include paid time off, paid holidays, as well as other types of leave, including paid parental, military, bereavement, and any applicable federal and state sick leave. Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards. Other incentives may be available based on position level and/or job specifics. **Senior Principle Process Engineer, Wire and Ribbon Bonding** **126597BR** EEO Career Site Equal Opportunity Employer. Minorities . females . veterans . individuals with disabilities . sexual orientation . gender identity . gender expression