Senior Substrate & 3DIC Packaging Engineer
TSMC - Taiwan Semiconductor Manufacturing Company Limited
A leading semiconductor company is seeking a Substrate / Advanced Package Engineer to join their innovative 3DIC design team in California. Candidates should have a Master's or Ph.D. with 15+ years of experience in advanced packaging technologies. The role involves design and simulation of complex substrate and packaging technologies, collaborating with cross-functional teams, and mentoring junior engineers. This position offers a competitive salary and benefits package. #J-18808-Ljbffr TSMC - Taiwan Semiconductor Manufacturing Company Limited
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