Mechanical Advanced Packaging Engineer

Job ID: 2617660

Location: Crane, IN, US

Date Posted: 2026-10-19

Category: Engineering and Sciences

Subcategory: Mechanical Engr

Schedule: Full-Time

Shift: Day Job

Travel: No

Minimum Clearance Required: Interim_Secret

Clearance Level Must Be Able to Obtain: Secret

Potential for Remote Work: ORA_HYBRID


Description


SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN.


JOB RESPONSIBILITES:

• Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly
• Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling
• Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation
• Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR)
• Collaborate with design teams to facilitate and document design development activities
• Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions
• Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages
• Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations
• Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders

Qualifications


REQUIRED EDUCATION AND EXPERIENCE:

• Bachelor's degree in mechanical or aerospace engineering
• 5+ years' experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue)
• Experience with or knowledge of systems engineering principles
• Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process

PREFERRED EXPERIENCE:

• Experience with missile system hardware design and analysis
• Familiarity with microelectronics packaging and assembly, including solder interconnect technologies

Target salary range: $80,001 - $120,000. The estimate displayed represents the typical salary range for this position based on experience and other factors.

SAIC is a premier technology integrator providing full life cycle services and solutions in the technical, engineering, intelligence, and enterprise information technology markets. SAIC is Redefining Ingenuity through its deep customer and domain knowledge to enable the delivery of systems engineering and integration offerings for large, complex projects. SAIC's approximately 15,000 employees are driven by integrity and mission focus to serve customers in the U.S. federal government. Headquartered in Reston, Virginia, SAIC has annual revenues of approximately $4.5 billion. For more information, visit saic.com. For information on the benefits SAIC offers, see .