Staff Engineer, APTD Photolithography

Department Intro The Advanced Packaging organization at Micron builds the foundation for the AI era, working at the intersection of materials, processes, and manufacturing to enable next‑generation memory and packaging technologies. The teams collaborate closely across R&D, manufacturing, and suppliers to turn innovation into scalable, high‑quality solutions. Position Overview As a Process Engineer focused on Advanced Packaging Photolithography, you will play a critical role in developing and optimizing lithography processes that directly impact product quality, yield, and reliability. This role offers hands‑on technical ownership, strong cross‑functional collaboration, and the opportunity to influence how advanced packaging technologies move from development into high‑volume manufacturing. Responsibilities Develop and optimize photolithography processes for advanced packaging applications, including thick and ultra‑thick photoresist patterning. Drive yield improvement, defect reduction, cost optimization, and risk management using structured problem‑solving and statistical methods. Identify, diagnose, and resolve lithography‑related process issues using failure analysis, FMEA, SPC, and related methodologies. Lead process, equipment, and material evaluations and support qualification and baseline changes. Collaborate with cross‑functional teams and suppliers to enable robust integration and smooth technology transfer to manufacturing. Minimum Qualifications Master’s or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical field. 3+ years of experience in semiconductor photolithography or related process engineering. Strong foundation in lithography fundamentals, including resist processing, alignment, overlay, and CD control. Experience applying DOE, SPC, and data‑driven analysis to process optimization. Ability to manage multiple priorities and resolve manufacturing line issues independently and collaboratively. Preferred Qualifications Experience with advanced packaging or backend semiconductor technologies. Hands‑on experience with lithography tools, track systems, and lithography‑related metrology. Experience developing processes for high‑aspect‑ratio or large topography features. Familiarity with wafer thinning, plasma dicing, bonding, or packaging‑specific patterning challenges. Experience leading or influencing cross‑functional technology development initiatives. Benefits Micron offers a choice of medical, dental and vision plans in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. Equal Employment Opportunity Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr 1000 Micron Technology, Inc.