SiP Layout Engineer: Flip-Chip & System-in-Package Expert
Analog Devices, Inc.
Analog Devices, Inc. seeks an experienced SiP layout design engineer with strong expertise in laminate and PCB layout for advanced semiconductor packaging. This role supports the development of flip-chip packages, system-in-package products, and module-based solutions across multiple market segments. You will collaborate with IC design, package engineering, and product teams to ensure layouts meet specifications, perform DRC and design reviews, and manage multiple layout projects with realistic #J-18808-Ljbffr Analog Devices, Inc.
Vacancy posted 16 hours ago
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