Process Application Engineer - Die Bonding

Process Application Engineer - Die bonding

Location: Chandler, Arizona | Full-Time | Up to 30% Travel

$90,000 - $100,000 base salary + company bonus and benefits package

If you have experience in semiconductor process engineering or advanced packaging and are looking for an opportunity to work with cutting-edge technology in a customer-facing role, we would be interested in hearing from you.

The Opportunity

An exciting opportunity is available for an experienced Applications Engineer to join an innovative capital equipment company specialising in die bonding solutions.

The company is at the forefront of advanced semiconductor assembly technology, supporting applications across quantum computing, brain-machine interfaces, advanced photonics, and heterogeneous integration.

Based in Chandler, Arizona, this role offers the chance to combine hands-on process engineering with customer interaction, technical demonstrations, and application development.

The Role

As a Semiconductor Process Applications Engineer, you will act as a technical expert supporting customers, the sales team, and international engineering colleagues.

Your responsibilities will include:

• Conducting equipment demonstrations, process development trials, and technical presentations.
• Working directly with customers to understand their requirements and develop customised process solutions.
• Supporting the installation, qualification, and troubleshooting of die bonding equipment at customer sites.
• Optimising semiconductor processes to improve accuracy, repeatability, and yield.
• Providing technical training to customers and internal teams.
• Gathering customer feedback and collaborating with international engineering teams on product improvements.
• Representing the company at industry events, conferences, and customer meetings.

About You

We are looking for an experienced engineer with a background in semiconductor manufacturing, advanced packaging, or semiconductor equipment applications.

Ideally, you will have:

• Bachelor's or Master's degree in Engineering, Materials Science, or a related technical field.
• 3–5 years of experience in semiconductor manufacturing, process engineering, or equipment applications.
• Hands-on experience with die bonding, wire bonding, wafer-level packaging, or related assembly equipment.
• Strong understanding of sub-micron process control and yield optimisation.
• Excellent troubleshooting, communication, and presentation skills.
• A customer-focused mindset with the ability to work collaboratively across technical and commercial teams.

Experience with advanced packaging technologies such as heterogeneous integration, wafer-level bonding, or 3D integration would be advantageous.

Why Join?

This is an opportunity to join a close-knit, technically driven team working on some of the most exciting developments in semiconductor technology.

You will have the opportunity to:

• Work with cutting-edge die bonding equipment.
• Support innovative applications including quantum computing and brain-machine interfaces.
• Develop your expertise across process engineering, customer applications, and technical sales.
• Collaborate with international engineering and product development teams.
• Make a tangible impact on the future of semiconductor assembly technology.

Location & Travel

The position is based daily at the company's office and demonstration laboratory in Chandler, Arizona, with domestic and international travel of up to 30%.

Apply Today

If you have experience in semiconductor process engineering or advanced packaging and are looking for an opportunity to work with cutting-edge technology in a customer-facing role, we would be interested in hearing from you.