Lead IC Package Design Engineer - RF/SiP
BLUE ORIGIN
BLUE ORIGIN is seeking a Packaging Engineering Lead to build and manage a team focused on developing state-of-the-art packaging solutions for RF/mmWave, MS, and Digital ASICs. This role requires over 12 years of experience in mass-volume IC package development, advanced knowledge in thermal and signal integrity simulations, and expertise in relevant design tools. Locations include San Diego, CA, Bay Area, or Renton, WA, with a temporary remote work exception in place. #J-18808-Ljbffr BLUE ORIGIN
Vacancy posted 1 day ago
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