Radio Frequency (RF) Architect, Texas Institute for Electronics

Radio Frequency (RF) Architect, Texas Institute for Electronics

This role will develop advanced RF and mixed-signal microsystems for high-performance communication, radar, and sensing applications. This includes defining RF front-end architectures, leading EM/circuit co-simulation, overseeing RF testing, and collaborating with partners to define design enablement requirements for next-generation RF packaging.

Architect RF and mixed-signal microsystems operating across K-band (18–27 GHz), Ka-band (27–40 GHz), and W-band (75–110 GHz) for high-performance, low-latency communication, radar, and sensing applications.

Define and drive RF front-end architectures, including LNAs, PAs, mixers, phase shifters, and T/R modules, optimized for 3.0D integration and advanced packaging flows.

Collaborate with device, packaging, and digital architects to achieve co-optimization of RF, thermal, and mechanical performance within heterogeneous multi-die systems.

Lead EM/circuit co-simulation and system-level modeling using tools such as HFSS, ADS, AWR, or CST to validate and tune design performance across process corners and temperature.

Oversee RF testing, characterization, and calibration at wafer, die, and module levels—developing test plans, de-embedding strategies, and measurement automation for K/W-band hardware.

Engage with foundry, EDA, and metrology partners to define design enablement requirements for next-generation RF packaging (e.g., hybrid bonding, AiP, glass/Si interposers).

Author technical documentation, reference designs, and design guidelines to accelerate ecosystem adoption of TIE's 3.0D RF microsystems platform.

M.S. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design.

At least 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above).

Deep expertise in S-parameter characterization, on-wafer measurements, vector network analysis, and de-embedding methodologies.

Proficiency with RF simulation and design tools such as Keysight ADS, Ansys HFSS, Cadence AWR, CST Studio, or equivalent.

Strong understanding of electromagnetic effects in packaging—signal integrity, coupling, and loss across interposers and redistribution layers.

Proven track record in RF testing automation, data analysis, and test correlation between EM models and measured results.

Ability to work cross-functionally with device, packaging, EDA, and system teams in a fast-moving R&D environment.

Location: Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Ph,D. in Electrical Engineering, Applied Physics, or related discipline focused on RF, microwave, or millimeter-wave design.

More than 8 years of hands-on experience designing, simulating, and testing RF/microwave ICs or modules (K-band and above).

Experience developing Antenna-in-Package (AiP), RFIC/SiP, or 3D-stacked RF front-end modules for advanced communications or sensing.

Familiarity with 3DHI design flows and RF/mixed-signal co-simulation using advanced EDA environments (Cadence, Synopsys, Siemens, Ansys).

Hands-on experience with wafer-level probing, cryogenic testing, or thermal-vacuum characterization for high-frequency systems.

Knowledge of GaAs, GaN, SiGe, or CMOS RF processes, and packaging constraints for high-frequency operation

Publication or patent record in millimeter-wave circuits, antennas, or RF packaging.

Strong technical writing and presentation skills for industry and defense-sector collaborations.

TIE pays industry-competitive salaries.

May work around chemical fumes

May work around standard office conditions

May work around chemicals

May work around electrical and mechanical hazards

Repetitive use of a keyboard at a workstation

Use of manual dexterity (ex: using a mouse)

Monday - Friday is 8am to 5pm, or flexible between 7am and 6pm.

Hybrid work arrangements may be possible, with travel up to 30–50% as needed. Any flexible arrangement would be subject to university policies and approval regarding employment laws and regulations.

Resume/CV

3 work references with their contact information; at least one reference should be from a supervisor

Letter of interest (optional)