[Summer 2027] TSMC AZ Internship Opportunities - Engineering Roles 1

Overview At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world‑changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here. TSMC Arizona engineering departments are looking for engineering talent to join our advanced technology fab, located in sunny Phoenix, Arizona. As a TSMC Intern , you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Job Roles Process Integration Engineer (PID) Intern Focus on analyzing Inline and EOL (End‑of‑Line) electrical data to determine causes for issues, in collaboration with Integration, YED (Yield Excellence Department), and Process/Equipment engineers. Yield Excellence Engineer (YED) Intern Focus on defect inspection methodology to effectively deduce the root cause of critical issues by collaborating with stakeholders and innovating current techniques to combat defect issues live on the production line. Process Engineer (PE) Intern Focus on delivering robust and efficient semiconductor manufacturing through data‑driven analytics and systematic problem‑solving. Optimize processes with experimental design, precision control, and statistical methods. Collaborate with suppliers to address technology gaps and focus on continuous improvement in stability, quality, yield, productivity, and safety. CMP : Chemical Mechanical Planarization CVD : Chemical Vapor Deposition PVD : Physical Vapor Deposition EPI : Epitaxy DIF : Diffusion WET : Wet Clean ME : Metrology Etch : Wet Etch and Dry Etch LIT : Lithography Equipment Engineer (EE) Intern Focus on improving and maintaining tool performance in a cleanroom environment to ensure quality production. Key duties include troubleshooting alarms, installing and qualifying new tools, resolving critical equipment issues, improving tool uptime, enhancing hardware capabilities, implementing preventive systems, and managing vendor relationships while coordinating with facilities, vendors, and manufacturing teams. CMP : Chemical Mechanical Planarization CVD : Chemical Vapor Deposition PVD : Physical Vapor Deposition EPI : Epitaxy DIF : Diffusion WET : Wet Clean ME : Metrology Etch : Wet Etch and Dry Etch LIT : Lithography Intelligent Manufacturing Engineer (MFG) Intern Focus on ensuring the timely delivery of high‑quality wafers by driving productivity and efficiency through advanced technologies such as Smart Scheduling and Precise Dispatching. Responsibilities include system optimization, productivity improvement initiatives, and quality defense enhancements to support daily operations. Advanced Material Handling System (AMHS) Engineer Intern Focus on automated systems that ensure efficient, timely, and accurate wafer transfers. Projects may include improving Delivery Time Accuracy (DTA) or enhancing Stocker dispatching systems to optimize lot movement and cycle times. Quality Management Engineer (AQE) Intern Support TSMC’s mission of world‑class quality systems by collaborating with Taiwan’s Central Quality team. Activities include monitoring wafer fabrication processes, analyzing manufacturing parameters, applying statistical methods, leveraging predictive analytics to optimize process control, and contributing to product success during launches and technology ramps while ensuring compliance with global quality standards. Product Engineering (PES) Intern Focus on analyzing yield and process issues to support customer needs and drive improvements in semiconductor manufacturing. Work involves identifying process and quality “sweet spots” to optimize yield efficiency, performing detailed layout analyses to uncover root causes, and conducting electrical and physical failure analyses to pinpoint process‑stage issues. Mask Engineering Intern (EBO) Ensure the performance, reliability, and efficiency of photomask tools within advanced manufacturing operations. Collaborate with tool owners to manage installation and maintenance of photomask equipment, partner with vendors to improve maintenance processes, and develop in‑line monitoring systems to proactively identify and address potential issues. Central Start‑Up (CST) Tool Install Engineer Intern Support the installation of manufacturing equipment and tools by conducting site assessments, preparing installation plans, and coordinating timelines with internal teams. Work on projects such as surveying construction sites to identify optimization opportunities, developing improvement proposals, presenting findings through reports or visual presentations, and demonstrating project management skills to streamline operations. Industrial Safety & Health (ISEP) Engineer Intern Support and promote workplace safety and environmental sustainability efforts in advanced semiconductor facilities. Collaborate across departments to implement safety protocols, evaluate hazards such as radiation, lasers, gases, and chemicals, conduct risk assessments, and refine high‑risk SOPs to maintain a safe and compliant work environment. Computer Integrated Manufacturing (CIM) Engineer Intern Join TSMC’s DevOps team to tackle analytical projects and machine vision tasks addressing production line issues. Work on projects like pattern recognition, machine learning, and web development while learning agile software development, implementing Prometheus and Grafana monitoring services on a Kubernetes platform, and building automated deployment pipelines in Microsoft Azure DevOps. Other engineering roles may exist beyond those listed above and duties may evolve as required. Minimum Qualifications for all roles Applicants must be legally eligible to work in the United States and have: Currently enrolled at an accredited university in a Bachelor, Master, or Ph.D. program in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Mechanical Engineering, Physics, Industrial Engineering, Civil Engineering, Construction, or a related field. Ability to work full‑time for 10 weeks (40 hours per week) on‑site at the Phoenix location during the following periods: Semester system: June 1, 2026 to August 7, 2026 Quarter system: June 22, 2026 to August 28, 2026 Knowledge of semiconductor manufacturing processes and design is a strong plus. Flexibility to change priorities and responsibilities to support business needs. Self‑motivated learner, proactive collaborator, and capable of presenting and discussing work and ideas within a team. Strong communication, computer, presentation, listening, and teamwork skills to contribute to the team and TSMC Arizona’s culture. Some roles may require: Lift weights in accordance with applicable regulations and safety guidelines, including NIOSH recommendations. Work in a cleanroom environment, gowning up in coveralls, hoods, boots, safety glasses, and gloves, and spending significant time on the factory floor working on tools. Work Location Phoenix, AZ Travel May require travel dependent on business needs. Relocation Assistance Relocation assistance available. By applying for these roles, you’ll also be considered for other positions that align with your qualifications. All positions may require access to export‑controlled technical data. Non‑U.S. persons may require an export license. U.S. persons include United States citizens, lawful permanent residents, and individuals admitted as refugees or asylees. #J-18808-Ljbffr TSMC - Taiwan Semiconductor Manufacturing Company Limited