Yield-Driven Package Assembly Engineer
Intel Corporation
Intel Corporation in Phoenix, Arizona is seeking a Package Assembly Low Yield Analysis Engineer for a lab-based role. This position involves working across teams on yield improvement and technical functions related to semiconductor manufacturing, requiring a Bachelor's Degree in materials or engineering and strong analytical skills. As the engineer, you will conduct various analyses and tests, drive innovation, and provide consultation on packaging problems. Candidates should have 3+ months of relevant experience and be capable of working in a fast-paced, technical environment. #J-18808-Ljbffr Intel Corporation
Vacancy posted 4 days ago
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