System Test HW Engineer, Amazon LEO

Amazon LEO is expanding global broadband access through a constellation of low Earth orbit satellites. You will be part of a team that works on cutting edge silicon design - chips engineered to operate in the harsh environment of space. We are looking for an HW Development Engineer to join the ASIC Team and own PCB design for Test and SW development platforms that enable validation and bring-up of our next-generation MODEM SOC. In this role, you will collaborate closely with silicon, firmware, and software engineers to build hardware that accelerates the path from tape-out to orbit.Key Job Responsibilities• Design, optimize and develop PCB schematics and layouts for SOC validation and SW development platforms using Siemens Xpedition• Collaborate with post-silicon engineers to define board requirements including debug access, instrumentation tap points, and high-speed interface breakout (SerDes, DDR, Ethernet SGMII/RGMII)• Work with firmware and software teams to ensure development boards meet early SW bring-up and driver development needs• Work with cross-functional teams (ASIC, firmware, mechanical) to translate silicon requirements into board-level implementations• Review signal integrity and power integrity analysis; incorporate SI/PI recommendations into layout• Own the board lifecycle from concept through fabrication, assembly, bring-up, and ECO managementExport Control Requirement:Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.Basic qualifications- Bachelor's degree in Electrical Engineering or a related field- 5+ years of experience in multi-layer PCB design (8+ layers) for mixed-signal systems- Proficiency in Siemens Xpedition for schematic capture and layout- Experience with high-speed digital interfaces: DDR, SerDes, Ethernet (SGMII, RGMII)- Working knowledge of low-speed protocols: I2C, SPI, I3C- Understanding of impedance-controlled routing and high-speed PCB design best practices- Experience with PCB fabrication, assembly processes, and lab bring-upPreferred qualification - Experience designing validation/development platforms with emphasis on debug accessibility and flexibility- Ability to review and interpret SI/PI simulation results (HyperLynx, Ansys SIwave, or similar)- Knowledge of power delivery network (PDN) design and high-density BGA fanout routing- Experience supporting firmware/SW development hardware needs (JTAG, UART, boot mode configurations)- Familiarity with revision control systems and collaborative design environments- MODEM or communications system hardware backgroundAmazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at .USA, TX, Austin - 136,000.00 - 184,000.00 USD annuallyUSA, WA, Redmond - 136,000.00 - 184,000.00 USD annually