Package Design Engineer: Signal & Power Integrity

Teradyne

Teradyne is seeking a Package Design Engineer with an electrical engineering foundation to support our advanced measurement ASIC products in the Semiconductor Test Division. You will work across chip, package, board interconnects, and collaborate with ASIC, PCB, thermal, mechanical, and supplier teams to develop analysis approaches and practical design solutions. Candidates should have a BSEE and 2+ years in semiconductor packaging or high-speed hardware, with experience in signal integrity, #J-18808-Ljbffr Teradyne

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Vacancy posted 9 hours ago

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