Process Engineer — III-V Semiconductor / Laser Wafer Fab

Position Overview We are seeking a Process Engineer to support and develop advanced III-V semiconductor laser wafer fabrication processes. The role will focus on InP BH laser fabrication, including photolithography, etching, film deposition, wafer cleaning, metrology, and process control. Key Responsibilities Support InP BH laser wafer fabrication processes. Work with photolithography, holographic grating, film deposition, dry/wet etching, and wafer cleaning processes. Monitor manufacturing processes using SPC and other process-control methods. Troubleshoot fabrication and process issues. Drive continuous process and yield improvements. Partner with device design engineers on DOE and new process development. Develop metrology methods to monitor and characterize wafer processes. Analyze process data and prepare engineering reports. Support process equipment maintenance and work with equipment suppliers. Develop work instructions and provide technical training to production technicians. Qualifications M.S. or Ph.D. in Electrical Engineering, Materials Science, Chemistry, Mechanical Engineering, or related discipline. 1–3 years of semiconductor fab experience. Hands-on experience with: Photolithography Dry/wet etching Wafer cleaning Experience with semiconductor process development, troubleshooting, and process control. Familiarity with characterization tools such as: SEM EDS Ellipsometer Profilometer Experience with III-V / InP / photonics / semiconductor laser fabrication is highly preferred. #J-18808-Ljbffr Glint Tech Solutions LLC