Die Fabrication Process Innovator

Description The Die Fabrication Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications. Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments, and adjust or optimize processes for Fab Operation. Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality. Guide and assist Process Technicians through challenging process steps. Analyze metrology results and disposition lots based on data and pass/fail criteria. Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team. Provide effective pass-downs to support uninterrupted operation in the Die Fabrication area. Sustain and improve processes for semiconductor bars and die fabrication. Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality and product yields. Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment. Assure that the manufactured products conform to specifications and application requirements. Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations Sustain existing processes in the areas of, Die Fabrication, wafer scribing, pick and place of chips, chips-to-wafer bonding, wafer dicing, bar dicing, and bar polishing, recipe creations, microscope inspections, chip placement control, wafers, bars, and chips defects control, and relevant metrology for process control. Create and maintain operating specifications for production processes and equipment. Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans. Description The Die Fabrication Process Development Engineer is responsible to help support the development of manufacturable, repeatable, and high yielding processes for state-of-the-art highly specialized devices in the fields of Aerospace, Defense, Bioelectronics, and High-Speed Communications. Partner with Integration Engineers, Customers, and Other Development Engineers to execute experiments, and adjust or optimize processes for Fab Operation. Partner with Product Engineering and Integration to help ensure effective new products and process introductions as well as consistent device performance and quality. Guide and assist Process Technicians through challenging process steps. Analyze metrology results and disposition lots based on data and pass/fail criteria. Report and summarize results from the metrology analysis and provide guidance to Integration Engineering Team and Process Development Engineering Team. Provide effective pass-downs to support uninterrupted operation in the Die Fabrication area. Sustain and improve processes for semiconductor bars and die fabrication. Partner with equipment engineering, operation, and management to improve cycle time, tool availability, quality and product yields. Using Document Control, Process Work Instructions, and Manufacturing Execution Systems, preserve working knowledge of all codes and standards applicable to assigned production equipment. Assure that the manufactured products conform to specifications and application requirements. Partner with Senior Development Engineering team and Integration teams to resolve deviations or technical issues by establishing a list of hypotheses, defining the experiment to validate or invalidate hypothesis, identify root-causes, implement corrective actions, document improved process, and train operations Sustain existing processes in the areas of, Die Fabrication, wafer scribing, pick and place of chips, chips-to-wafer bonding, wafer dicing, bar dicing, and bar polishing, recipe creations, microscope inspections, chip placement control, wafers, bars, and chips defects control, and relevant metrology for process control. Create and maintain operating specifications for production processes and equipment. Monitor process health with Statistical Process Control (SPC) and respond to out-of-control event following out-of-control action plans. Requirements Work Environment 80%+ of work is performed in the Fab, which a temperature-controlled cleanroom environment that requires the use of a full-body gown, over-boots, over-hood, safety glasses, and other PPE. The use of personal protective equipment to prevent exposure to hazardous materials can be expected. Frequent gowning and de-gowning is required. Frequent interruptions, static noise, and alarms (auditory and flashing lights) can be expected. Bachelor’s or Master’s degree in Mechanical Engineering, Material & Science, Physics or Chemistry with hands-on lab experience Processing experience in a fab or a lab in the areas of Mechanical Engineering using robotics and programming Ability to make technical mechanical drawings using SolidWorks Programming experience with Visual Basic, Excel Macros, and/or Python Experience and good understanding of statistical concepts Basic understanding of algebraic concepts Data extraction, analysis, and reporting experience Basic understanding of Die Fabrication processing Ability to troubleshoot basic problems and address root causes Ability to understand all maintenance activity details required to ensure a healthy and repeatable process Ability to plan and prioritize activities, perform and monitor multiple overlapping tasks/operations to meet goals and timelines. Ability to operate robots, processing tools, write and run process recipes, inspect wafers/bars/chips under the microscope, and perform basic characterization related to Die Fabrication processing such as particles / defects metrology, and thickness / uniformity metrology Must be able to work offset shifts: Front-End Days (starts on Sundays, ends on Thursdays) or Back-End Days (starts on Tuesdays, ends Saturdays) Preferred Education And Experience Bachelor’s or Master’s degree with strong hands-on lab experience Experience working on hands-on projects Work Authorization/Security Clearance Requirements Authorization may be required to release covered technology to employees who are not U.S. citizens, U.S. nationals, lawful permanent residents, asylees, or refugees. #J-18808-Ljbffr Work Options Group