Head of Chip Cooling & Fast Thermal Simulation — Equity

Flexcompute is a cutting-edge technology startup that specializes in ultra-fast simulation technology. Our products are utilized by companies in designing and optimizing technology products, with applications ranging from designing airplanes and cars to wind turbines and quantum computing chips. Our customer base includes both household names and startups in emerging industries. Our company was founded by world-renowned leaders in simulation technology from Stanford University and MIT. Backed by top VC firms, we are poised to disrupt the billion-dollar engineering simulation industry with our fast-growing trajectory

The Mission

The semiconductor industry is hitting a “thermal wall.” As chip power densities exceed 1000W, traditional design cycles are too slow to keep up. Flexcompute is looking for a visionary Lead to spearhead our entry into the chip cooling industry. You will use our proprietary, high-performance physics simulation technology to help customers design the next generation of liquid cooling, immersion systems, and advanced heat sinks for AI and HPC hardware.

Key Responsibilities

• Strategy & Product Roadmap: Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
• Technical Leadership: Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
• Solution Architecting: Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
• Market Evangelism: Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
• Team Building: Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.

• Education: PhD or MS in Mechanical Engineering, Applied Physics, or a related field with a focus on Heat Transfer and Fluid Dynamics .
• Experience: 8+ years in thermal management for electronics. You have likely led thermal architecture for high-TDP processors or high-performance server systems.
• Simulation Mastery: Expert-level proficiency in thermal simulation tools. You must understand the underlying physics well enough to articulate why a GPU-accelerated or novel solver approach is transformative.
• Industry Knowledge: Deep familiarity with the roadmap of AI hardware, OCP (Open Compute Project) standards, and the transition from air to liquid cooling.

The Ideal Candidate

• You are frustrated by the slow turnaround times of current CAE software.
• You have the network to open doors at major foundries and data center equipment manufacturers.

• Competitive compensation with equity of a fast-growing startup.
• Medical, dental, and vision health insurance.
• 401(k) Contribution.
• Gym allowance.
• Friendly, thoughtful, and intelligent coworkers.