Test Engineer

Requisition Number: 30480

Required Travel: 0 - 10%

Employment Type: Full Time/Salaried/Exempt

Anticipated Salary Range: $79,869.00 - $180,000.00

Security Clearance: Ability to Obtain

Level of Experience: Mid

This opportunity resides with Warfare Systems (WS) , a business group within HII’s Mission Technologies division. Warfare Systems comprises cyber and mission IT; electronic warfare; and C5ISR systems.

HII works within our nation’s intelligence and cyber operations communities to defend our interests in cyberspace and anticipate emerging threats. Our capabilities in cybersecurity, network architecture, reverse engineering, software and hardware development uniquely enable us to support sensitive missions for the U.S. military and federal agency partners.

Leadership at HII – Mission Technologies
HII’s Leadership Capability Framework defines the standard of excellence expected of all leaders across Mission Technologies. Leaders are accountable for modeling these capabilities and building them within their teams:

• Know & Grow Your People – Develop talent, empower teams, and build an inclusive environment.
• Build Relationships – Strengthen trust, collaboration, and cross-functional partnerships.
• Take Ownership – Drive accountability, execution excellence, and results.
• Customer First – Anticipate mission needs and deliver value to our partners.
• Shape the Future – Inspire innovation and align work with strategic priorities.
• Act with Urgency – Make informed decisions and move with purpose.

These capabilities define how leaders inspire teams, deliver results, and shape the future of Mission

Job Description

We are seeking a hands-on Electronics Packaging, Reliability & Test Engineer to lead prototype hardware build, reliability test, and failure analysis in support of the U.S. Army Research Laboratory (ARL) in Adelphi, MD . This role blends electronics packaging, thermal/electrical/mechanical analysis, bench-level testing, and manufacturing/DFM to deliver rugged, field-ready systems.

You’ll collaborate in a multidisciplinary environment (EE, ME, materials, computer science, and research staff) to:

• Package and protect die-level and PCB assemblies using polymerics (adhesives, staking, encapsulation, underfills) and metals (solder alloys, sintered joints),
• Model stresses and failure modes (thermal, electrical, mechanical, vibration),
• Execute rigorous lab and field test campaigns (THB, temperature cycling, vibration, dielectric strength, partial discharge), and
• Perform both destructive and non-destructive analysis to drive design improvements.

This is an excellent fit for engineers who love building, instrumenting, and testing their own designs—and who understand how materials, process, and environment drive reliability.

HII has partnered with ARL for more than 18 years, supporting mission critical R&D, prototyping, and evaluation. This position offers the opportunity to lead technical activities, mentor junior personnel, and contribute directly to impactful, emerging technologies. Come support our work with the U.S. Army Research Laboratory and join a world class team of groundbreaking scientists and engineers!

Test Engineer 2: $80,000 - $115,000

Test Engineer 3: $99,000 - $145,000

Test Engineer 4: $121,000 - $180,000

Essential Job Responsibilities

• Advanced PCB & Module Assembly

• • Assemble and solder complex mixed-signal boards (analog/digital/RF), including SMT and through-hole.
  • Integrate electronics into electromechanical housings, ensuring fit, thermal paths, strain relief, shielding, sealing, and serviceability.
  • Implement packaging best practices: die attach, wire bonding, underfill/encapsulation/staking, conformal coating, and strain mitigation for connectors and harnesses.

• Materials & Process Engineering

• • Select and qualify adhesives (air, bake, UV cure), underfills, potting compounds, coatings, and solder/sintered metallurgical systems based on CTE match, Tg, modulus, outgassing, moisture ingress, electrical performance, and service environment.
  • Define process recipes (surface prep, cure schedules, bake profiles, reflow profiles, bond parameters) and create work instructions.

• Mechanical CAD & Simulation

• • Create mechanical designs and engineering drawings (GD&T) in SolidWorks for custom enclosures, brackets, thermal interfaces, and fixtures.
  • Conduct FEA/Multiphysics modeling in ANSYS Workbench or COMSOL for thermal stress, mechanical stress, electrical stress, and vibration/modal analysis; propose mitigations (stiffeners, damping, isolation, fasteners, fillets/chamfers, materials).

• Manufacturing & DFM

• • Develop DFM guidelines and release designs for CNC machining, sheet metal, injection molding, and 3D printing; coordinate with machine shops/vendors and review NCRs/FAI results.
  • Build/iterate test fixtures and jigs for repeatable assembly and measurement.

• Benchtop & Environmental Testing

• • Set up and operate probe stations, heated stages, temperature-humidity-bias (THB) chambers, and temperature cycling (e.g., -40°C to +85°C) with relevant dwell/ramp profiles.
  • Execute frequency-domain signal analysis (FFT, spectrum analysis) of mixed-signal/RF chains using oscilloscopes, spectrum/network analyzers, and data acquisition.
  • Develop test plans, procedures, and acceptance criteria; capture repeatable datasets and traceability.

• Failure Analysis & Inspection

• • Perform destructive analyses: cross-sectioning, grinding, polishing, optical inspection—document defects (voiding, cracks, delamination, intermetallics, corrosion).
  • Conduct non-destructive analyses: X-ray and Scanning Acoustic Microscopy (SAM/C‑SAM) for voids, bond quality, underfill coverage, and delamination.
  • Drive root cause analysis (RCA) and corrective actions; maintain FA reports and lessons learned.

• Documentation & Lab Ops

• • Author and maintain assembly procedures, test protocols, drawings, BOMs, RCA/FA reports, and engineering memos.
  • Manage lab equipment inventories, calibration schedules, and component stock (Excel/O365); ensure ESD, safety, and quality compliance.

Minimum Qualifications

• 2-9 years relevant experience with Bachelors in related field; 0-7 years relevant experience with Masters in related field; 0-4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 6-13 years relevant experience.
• Test Engineer 2 - 2 years relevant experience with Bachelors in related field; 0 years experience with Masters in related field; or High School Diploma or equivalent and 6 years relevant experience.
• Test Engineer 3 - 5 years relevant experience with Bachelors in related field; 3 years relevant experience with Masters in related field; 0 years experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 9 years relevant experience.
• Test Engineer 4 - 9 years relevant experience with Bachelors in related field; 7 years relevant experience with Masters in related field; 4 years relevant experience with PhD or Juris Doctorate in related field; or High School Diploma or equivalent and 13 years relevant experience.
• Demonstrated proficiency in electronics packaging and test, including:

• • Soldering (SMT & through-hole), cable/harness assembly, and PCB rework under microscope.
  • Reading/creating schematics, assembly drawings, BOMs, and work instructions.
  • Setting up and operating lab instrumentation (DMMs, oscilloscopes, spectrum/network analyzers, power supplies, temperature chambers, probe stations).
  • Executing frequency-domain signal analysis for diagnostics and performance verification.
  • Hands-on mechanical aptitude integrating electronics into housings/fixtures.

• Strong Microsoft Office 365 (Excel, Word, PowerPoint, SharePoint/OneDrive) for data, documentation, and collaboration.
• Clearance: Ability to obtain and maintain a SECRET security clearance.

Preferred Requirements

• Packaging & Materials

• • Experience with IPC J-STD-001 and IPC-A-610 workmanship standards.
  • Deep familiarity with adhesives/underfills/encapsulants (cure kinetics, rheology, Tg, modulus, moisture absorption) and solder alloys/sintered joints (wetting, intermetallics, voids, thermal cycling behavior).
  • Wire bonding (ball/wedge) process experience; flip-chip underfill selection & dispensing.
  • Experience with high-dielectric-strength encapsulants and partial-discharge-resistant insulation materials to suppress electric field concentrations and prevent breakdown under extreme high-voltage transient regimes.
  • Experience in developing multi-die electronic power modules (SiC or GaN) utilizing kilovolt(kV)-rated MOSFETs, IGBTs, and diodes.

• CAD/Simulation

• • Proficiency with SolidWorks (assemblies, drawings, GD&T) and ANSYS Workbench/COMSOL Multiphysics for thermal/mechanical/electrical/vibration analysis.
  • Experience with PCB CAD (e.g., Altium) for stack-up, keep-outs, and packaging-aware layouts.

• Manufacturing & DFM

• • Experience delivering hardware via CNC, sheet metal, injection molding, and 3D printing (FDM/SLA/SLS), including DFM, tolerance stack-up, and supplier engagement.
  • Knowledge of fixture design and metrology for repeatable assembly and measurement.

• Reliability & Test

• • Environmental testing (e.g., THB, temp cycling, vibration/modal, high-voltage partial discharge), and data analysis for reliability predictions.
  • Non-destructive evaluation (X-ray, C‑SAM) and destructive FA (cross-sectioning, polish, microscopy).
  • Experience authoring test plans, qualification protocols, and FA/RCA reports.

• Wafer-Level / Cleanroom

• • Exposure to wafer-level processes and cleanroom tools (e.g., lithography, deposition, etch, wire bonders, die attach)—useful for die-to-interposer packaging workflows.

• Field Test Experience

• • Prior support of laboratory and field test events for R&D programs, with a focus on ruggedization and rapid iteration.

Physical Requirements

• Work in office, industrial, and laboratory environments; comfortable with ladders, confined spaces, and temperature variances.
• Fine motor skills for microscope-level assembly (e.g., wire bonding, micro-soldering).
• Ability to lift lab equipment/fixtures and stand at benches for extended periods.

The listed salary range for this role is intended as a good faith estimate based on the role's location, expectations, and responsibilities. When extending an offer, HII's Mission Technologies division takes a variety of factors into consideration which include, but are not limited to, the role's function and a candidate's education or training, work experience, and key skills.

Together we are working to ensure a future where everyone can be free and thrive.
All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, physical or mental disability, age, or veteran status or any other basis protected by federal, state, or local law.

Do You Need Assistance?
If you need a reasonable accommodation for any part of the employment process, please send an e-mail to View email address on aiapply.co and let us know the nature of your request and your contact information. Reasonable accommodations are considered on a case-by-case basis. Please note that only those inquiries concerning a request for reasonable accommodation will be responded to from this email address. Additionally, you may also call View phone number on aiapply.co for assistance. Press #3 for HII Mission Technologies.